Test, Tune and Field Service Engineer

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profile Job Location:

Singapore - Singapore

profile Monthly Salary: Not Disclosed
Posted on: 2 days ago
Vacancies: 1 Vacancy

Job Summary

Job description

Job Offer: Test Tune and Field Service Engineer at Boschman Advanced Packaging Technology

Boschman Advanced Packaging Technology is a high-tech engineering-driven Dutch company specializing in advanced back-end semiconductor packaging solutions. We offer a one-stop-shop concept for semiconductor packaging activities focusing on Package Development Services Assembly & Test Services and Industrial Equipment. Our expertise lies in advanced transfer molding and sintering systems catering to high-growth market segments such as Power Electronics MEMS and Sensors.

We are at the forefront of the Global Energy Transformation and Electric Revolution leading with technology in Pressure Sintering and Advanced Molding. Our culture fosters a dynamic and enthusiastic working environment encouraging flexibility drive and initiative. Join our innovative and solution-driven team for a rewarding career in the high-tech industry.

Job Description:

  • Combination of testing tuning and field service activities

  • Conduct testing tuning and quality inspections on assembled systems

  • Perform Factory Acceptance Tests (FAT) and Site Acceptance Tests (SAT)

  • Collaborate with engineering and production teams to identify and resolve issues

  • Provide on-site field service support for installation commissioning and testing

  • Diagnose and resolve technical issues perform troubleshooting and repairs

  • Support new product introductions and knowledge transfer

  • Document test results service activities and improvement actions

Reporting: You will report to the Manager Test Tune & New Product Field Support.

If you are looking for a challenging role in a global high-tech company with a focus on innovation and technology leadership we welcome you to join our team in Singapore. Be part of our family and contribute to shaping the future of semiconductor packaging solutions.

Job requirements

Offer Requirements:

  • MSc or BSc degree in Mechanical or Mechatronics Engineering.

  • Minimum of 5 years of experience in a technical role within high-tech or semiconductor equipment industries.

  • Proficient in working with 3D design systems (i.e. Solid works).

  • Strong understanding of mechanical hydraulic pneumatic motor-driven and electrical components within complex high-tech systems.

  • Understanding specifications and norms within the back-end semiconductor equipment industry.

  • Capable of working independently able to set priorities and to meet deadlines.

  • Strong analytical and problem-solving skills.

  • Good communication skills and a customer-oriented mindset.

  • Willingness to frequently travel internationally.

Interested

Does the position fit your skills and ambition and do you expect to be able to contribute to our

company

Then we would like to get in touch with you! Please send your application (CV plus motivation letter) to

Pricia Lim (Office manager BTA) and we will contact you soon.

Do you have questions regarding the content of the position up forehand Then you may contact

Jules van Ee (General Manager BTA) at or by telephone: (65)

All done!

Your application has been successfully submitted!


Required Experience:

IC

Job descriptionJob Offer: Test Tune and Field Service Engineer at Boschman Advanced Packaging TechnologyBoschman Advanced Packaging Technology is a high-tech engineering-driven Dutch company specializing in advanced back-end semiconductor packaging solutions. We offer a one-stop-shop concept for sem...
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