Package Silicon Technology Node Development DirectorDMTS
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Job Summary
Our vision is to transform how the world uses information to enrich life for all.
Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity sustainability and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.
Director / DMTS Package Development Engineering (PDE)
Role Overview
Micron Technology is seeking an accomplished technical leader to join our Package Development Engineering (PDE) organization as a Director / Distinguished Member of Technical Staff (DMTS).
In this role you will define and drive chip-package interaction (CPI) technology strategy and roadmaps to enable advanced silicon node transitions in next-generation memory products. You will operate at the intersection of silicon package and system-level integration ensuring robust technology readiness and risk mitigation across increasingly complex design and process landscapes.
This is a high-impact cross-functional leadership role requiring close collaboration with global engineering teams spanning Fab Process Integration Product Development Package Design Assembly Technology Development and Global Quality. You will play a critical role in shaping future memory product success through technology innovation risk management and execution excellence.
Key Responsibilities
Technical Leadership & Strategy
Define develop and maintain long-term chip-package interaction (CPI) technology roadmaps aligned with advanced silicon node transitions
Drive technology strategy and risk management frameworks to support future memory product launches
Lead global technical initiatives to ensure alignment between silicon package and test vehicle readiness
Cross-Functional Collaboration
Partner closely with teams in: Fab Process Integration Product Design & Development Package Design & Assembly Technology Development Global Quality & Reliability Engineering
Establish and drive CPI risk identification modeling and mitigation strategies across development cycles
Ensure seamless integration of design process and packaging requirements across multiple business units and geographies
Execution & Alignment
Align priorities timelines and resource planning with senior leadership and key stakeholders
Drive execution rigor across programs ensuring technology readiness and delivery milestones are met
Influence decision-making through data-driven insights and technical expertise
Thought Leadership
Serve as a subject matter expert in CPI failure mechanisms and reliability risks
Mentor and guide engineering teams fostering a culture of technical excellence and innovation
Represent PDE in strategic discussions with internal and external stakeholders
Required Skills & Expertise
Deep understanding of semiconductor process technology development including business processes and strategic planning
Strong knowledge of memory technologies and semiconductor device physics (preferred)
Demonstrated expertise in: Chip-package interaction (CPI) failure mechanisms Reliability physics and risk assessment methodologies Failure analysis qualification and screening techniques
Proven ability to lead complex cross-disciplinary programs across global organizations
Strong collaboration and stakeholder management skills in a matrixed environment
Proven experience in technical leadership mentoring and driving organizational impact
Ability to manage multiple high-impact initiatives simultaneously
Excellent communication and presentation skills with the ability to influence both technical and executive audiences
Qualifications
Masters or PhD in Materials Science Electrical Engineering Chemical Engineering Physics Chemistry or a related technical discipline
15 years of experience in semiconductor technology development packaging or related fields
Extensive experience in:Chip-package interaction and integration challenges Electrical and physical failure mechanisms Reliability testing qualification and screening methodologies
Strong track record of technical innovation and impact evidenced by:Publications Patent Industry contributions
About Micron Technology Inc.
We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich lifefor all. With a relentless focus on our customers technology leadership and manufacturing and operational excellence Micron delivers a rich portfolio of high-performance DRAM NAND and NOR memory and storage products through our Micron and Crucial brands. Every day the innovations that our people create fuel the data economy enabling advances in artificial intelligence and 5G applications that unleash opportunities from the data center to the intelligent edge and across the client and mobile user experience.
To learn more please visit qualified applicants will receive consideration for employment without regard to race color religion sex sexual orientation gender identity national origin veteran or disability status.
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Micron Prohibits the use of child labor and complies with all applicable laws rules regulations and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
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Director
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About Company
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