Staff Package Design Engineer

In this role you will work at the intersection of IC design advanced package development and system-level implementation. You will play a critical role in designing and delivering next-generation high-performance semiconductor package solutions including power modules chiplet-based architectures FCBGA SiP WLCSP wire-bonded QFP and QFN packages supporting automotive SoCs industrial IoT microcontrollers and AI-enabled embedded computing platforms. This role requires strong technical depth in package layout execution manufacturability assembly process constraints and cross-domain co-design with global silicon design signal integrity/power integrity thermal reliability and product engineering teams.

Key Responsibilities

• Execute package layout design and development for advanced package technologies including power modules FCBGA SiP WLCSP and multi-chip modules.
• Develop and maintain package CAD databases ensuring accuracy and adherence to package design guidelines DFM and DFA requirements to support manufacturability yield and long-term reliability.
• Manage the package design cycle including schematic creation netlist import footprint assignment layout implementation verification and generation of manufacturing release outputs such as Gerber/drill data fabrication drawings assembly drawings bump maps and related documentation.
• Create and modify substrate and RDL layouts bump maps escape routing stack-up structures and power/ground distribution features.
• Collaborate with SI/PI thermal reliability DFT silicon design product engineering and manufacturing teams to support package-level co-optimization and participate in design reviews.
• Ensure package designs comply with applicable foundry OSAT substrate vendor and manufacturing design rules including DRC LVS connectivity and netlist verification requirements.
• Support Engineering Change Order cycles design updates revision control and release documentation throughout the project lifecycle.

Qualifications :

• 4 years of hands-on experience in package CAD layout substrate design or advanced package development; 6 years preferred.
• Strong background in power module packaging FCBGA SiP WLCSP advanced substrate-based packages and multi-die/chiplet-based package architectures.
• High proficiency with industry-standard package design tools such as Cadence Allegro Package Designer / SiP Layout Siemens Xpedition Substrate Integrator or equivalent CAD platforms.
• Proven experience applying advanced package design rules substrate vendor constraints OSAT assembly requirements DFM/DFA principles and manufacturing release standards.
• Experience interfacing directly with Tier-1 OSATs substrate suppliers foundries silicon design teams and product engineering teams.
• Working understanding of SI/PI fundamentals high-speed routing impedance control power/ground distribution and crosstalk mitigation.
• Strong communication presentation and technical documentation skills with demonstrated experience working effectively in global cross-functional engineering environments.

Education

• Bachelors or Masters degree in Electrical Engineering Microelectronics Materials Science or a related technical discipline.

Additional Information :

Renesas is an embedded semiconductor solution provider driven by its Purpose To Make Our Lives Easier. As the industrys leading expert in embedded processing with unmatched quality and system-level know-how we have evolved to provide scalable and comprehensive semiconductor solutions for automotive industrial infrastructure and IoT industries based on the broadest product portfolio including High Performance Computing Embedded Processing Analog & Connectivity and Power.
 
With a diverse team of over 22000 professionals in more than 30 countries we continue to expand our boundaries to offer enhanced user experiences through digitalization and usher into a new era of innovation. We design and develop sustainable power-efficient solutions today that help people and communities thrive tomorrow To Make Our Lives Easier.     
 
At Renesas you can: 

• Launch and advance your career in technical and business roles across four Product Groups and various corporate functions. You will have the opportunities to explore our hardware and software capabilities and try new things.  

• Make a real impact by developing innovative products and solutions to meet our global customers evolving needs and help make peoples lives easier safe and secure. 

• Maximize your performance and wellbeing in our flexible and inclusive work environment. Our people-first culture and global support system including the remote work option and Employee Resource Groups will help you excel from the first day.    

Are you ready to own your success and make your mark  

Join Renesas. Shape Your Future with Us.  

Renesas Electronics is an equal opportunity and affirmative action employer committed to celebrating diversity and fostering a work environment free of discrimination on the basis of sex race religion national origin gender gender identity gender expression age sexual orientation military status veteran status or any other basis protected by federal state or local law. For more information please read our Diversity & Inclusion Statement.

Renesas Electronics deals with dual-use technology that is subject to U.S. export controls regulations. Under these regulations it may be necessary for Renesas to obtain U.S. government export license prior to release of technology to certain persons. The decision whether or not to file or pursue an export license application is at the sole discretion of Renesas.

Remote Work :

No

Employment Type :

Full-time