Sr. Hardware Engineer (Teradyne, Oregon)

We are the global test and automation specialists powering next-generation technologies through sophisticated solutions. Behind every electronic device you use Teradynes test technology ensures your device works right the first time every time! Our portfolio of automation solutions help manufacturers to develop and deliver products quickly efficiently and cost-effectively. TogetherTeradynecompanies deliver manufacturing automation across industries and applications around the world!

We attract develop and retain a high-performance workforce comprised of people with diverse backgrounds and a shared drive for excellence. We strive to foster a positive and inclusive work environment that helps employees and communities thrive.

Our Purpose
TERADYNE where experience meets innovation and driving excellence in every connection. We are fueled by creativity and diversity of thought and in our workforce. Our employees are supportedto innovate and learn something new every day.

We cultivate a culture of inclusion for all employees that respects their individual strengths views and experiences. We believe that our differences enable us to be a better team one that makes better decisions drives innovation and delivers better business results.

Opportunity Overview

The Senior Hardware Engineer in the hardware group is responsible for designing developing and validating highcurrent highpower sourcing and switching hardware used in semiconductor automated test equipment. This role focuses on power delivery architecture fast transient response load regulation protection systems thermal management and systemlevel integrationto support advanced SoCs FPGAs highpower devices and complex test conditions. The engineer owns powerdelivery modules from concept through production release and collaborates across hardware firmware mechanical and test engineering teams.

Power Delivery Architecture & Design

• Architect and design highcurrent power delivery modules (from mA to100 A) for ATE systems.
• Develop fastresponse voltage/current sourcing circuits optimized for dynamic load conditions droop control and transient performance.
• Implement advanced powerstage topologies (buck multiphase linear hybrid) tailored for semiconductor test environments.
• Design for wide operating ranges including highvoltage rails lowvoltage/highcurrent rails and dynamic voltage scaling.

Power Integrity & Transient Performance

• Optimize power integrity across the full PDN (instrumentation cabling loadboard DUT).
• Model and mitigate droop overshoot ringing and ground bounce under fast load steps.
• Perform simulation and analysis of loop stability compensation networks and transient response.
• Ensure compliance with DUT powerup sequencing ramp rates and timing constraints.

Protection Reliability & Safety

• Design robust protection systems including OCP OVP OTP shortcircuit protection and faultisolation mechanisms.
• Implement fast faultresponse circuits to protect sensitive DUTs and ATE hardware.
• Conduct reliability analysis derating studies and thermal modeling for longterm stability.
• Support HALT/HASS stress testing and failuremode investigations.

Switching Routing & Load Management

• Develop efficient highcurrent solutions for routing power to multiple DUT pins or sites.
• Engineer lowimpedance lowloss paths for highcurrent delivery with attention to thermal and mechanical constraints.
• Collaborate with mechanical teams on heatsinking airflow and thermal interface design.

BringUp Debug & Validation

• Lead bringup of new powerdelivery modules performing rootcause analysis of analog digital and mixedsignal issues.
• Execute characterization plans for load regulation transient response efficiency thermal behavior and fault handling.
• Use advanced lab equipment (power analyzers highbandwidth scopes current probes electronic loads) to validate performance.

ATE System Integration

• Ensure powerdelivery modules meet ATE systemlevel requirements for timing triggering synchronization and software control.
• Collaborate with firmware teams on control loops telemetry calibration and faultreporting algorithms.
• Create and use ATE test programs to validate instrument and system level designs.
• Support integration with loadboards probecards and DUT powerdelivery networks.

CrossFunctional Collaboration

• Work with product engineering test engineering and silicon teams to define powerdelivery requirements for new devices.
• Provide technical mentorship and contribute to powerdelivery design standards and best practices.

All About You

• 8- 10 years of experience in power electronics highcurrent power delivery or instrumentation hardware design.
• Strong expertise in switching power supplies multiphase regulators linear regulators and powerstage design.
• Experience with power integrity transient analysis and compensation/stability design.
• Proficiency with SPICE simulation PDN modeling tools and PCB design tools.
• Handson experience with power measurement equipment and highcurrent test setups.
• Strong analytical and debugging skills.

• Experience designing powerdelivery modules for ATE instrumentation.
• Knowledge of dynamic voltage scaling digital power control and telemetry systems.
• Familiarity with highcurrent connectors cabling and lowimpedance mechanical design.
• Understanding of thermal modeling heatsink design and systemlevel thermal constraints.
• Bachelors or Masters degree in Electrical Engineering or related field.

Compensation:
The base salary range for this role is$141400 - $ range is a good faith estimate and the amount of base salary will correspond with experience and skill set. This range can also fluctuate depending on demand and location.

Incentive Plan: This job is eligible for discretionary bonus(es) based on financial performance.

Benefits:

Teradyne offers a variety of robust health and well-being benefit programs including medical dental vision Flexible Spending Accounts retirement savings plans life and disability insurance paid vacation & holidays tuition assistance programs and more. Please click here to see details.

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