SeniorStaff Equipment Development Engineer (APTD)

Our vision is to transform how the world uses information to enrich life for all.

Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity sustainability and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

As a Senior or Staff Equipment Development Engineer in Microns Advanced Technology Packaging Development (APTD) team you will be primarily responsible for developing and optimizing next generation first of a kind (FAOK) wafer and die equipment (Post probe wafer and die development) to improve capability productivity and cost of such equipment. You will take ideas from conception through equipment and sub-component development all the way to implementation in APTD and manufacturing facilities. You will also be required to identify diagnose and resolve equipment related problems by applying failure analysis FMEA 8D or FDC/Data Science methodology. Additional responsibilities include coordinating and carrying out equipment evaluation/optimization to implement changes leading and participating in equipment maturity and availability improvement and cost reduction activities.

You will be working in a highly collaborative atmosphere interacting with various groups such as process development manufacturing and equipment vendors to ensure robust processes that meet the detailed physical requirements for Micron products. You will grow into an expert engineer driving post probe wafer and assembly technology roadmaps which have a direct influence on Microns global leadership in semiconductor manufacturing.

Job Description

Key responsibilities and duties include:

• Develop and optimize advanced packaging equipment for technology enablement including wafer-level packaging and stacking

• Focus on improving equipment capability enabling process improvements reducing costs and enhancing productivity

• Establish and improve equipment management projects to deliver tech node requirements

• Evaluate and promote new equipment and materials to enhance process capabilities

• Establish hardware strategic roadmaps for 5 years in post probe wafer and die processing

• Developing wafer and assembly equipment to meet the physical and electrical requirements of Microns products. cost availability and improve hardware and process capability

• Ensure defense coverage through process measurement inspection and testing

• Establish correlations between defense mechanisms to identify improvement opportunities

• Conduct continuous data analysis to establish advanced controls and identify improvement opportunities with SMAI team

• Good knowledge of Wafer Fab Manufacturing system eg: MES ETO Autoshell and E3 FDC is preferred

• Develop hardware roadmaps for 5 years in post probe wafer and die processing process area

• Collaborating with process development teams to develop innovative new solutions.

• Performing fundamental research to drive innovative solutions for next-generation equipment products.

• Work closely with internal and external partners to build and execute technology development strategies aligned with organizational and business objectives

• Lead the equipment team to work closely with various teams including the Package Integration PWF/Assembly Engineering Front End Wafer Fab Assembly/Test Engineering Product Engineering and Global Quality to integrate manufacturing processes for optimal performance and quality control

• Lead and ensure smooth transition from new product development qualification small volume production to high volume production

• Constructs forecasts proposals and strategic/tactical plans based on business data and market intelligence

• Integrates AI-assisted tools and insights into daily work to improve efficiency quality or effectiveness exercising sound judgment and complying with organizational standards and legal requirements.

• Contributes to a culture of continuous improvement by identifying testing and sharing AI-enabled enhancements within ones scope of work.

Education and Experience.

• B.S/M.S./Ph. D. (or equivalent education) in Materials Science Chemical Engineering Electrical Engineering Mechanical Engineering Physics or other related technical fields.

• 5 or more years of semiconductor process or equipment engineering experience preferably in wafer bonding plating warpage control and packaging field stacking process equipment TC bonder/ Hybrid Bonder

• Proficiency in Python R SQL for statistical analysis process modeling and data analytics is preferred

• Experience with Visual Basic for automation and tool integration.

• Familiarity with E3 FDC (Fault Detection and Classification) and RMS (Recipe Management System) for equipment and process control.

• Strong data analytics capabilities to support SPC DOE defect analysis and dashboarding

• Experience in equipment development with fundamental understanding to execute to improve equipment maturity for First of a Kind (FOAK) hardware

• Experience in wafer bonding plating warpage control and packaging process development and understanding of related inline/electrical/probe failure

• Knowledge of semiconductor processing solid-state device physics desirable

• Consistent track record to solve problems and address root causes

• Ability to apply baseline digital fluency and roleappropriate AI literacy to use AIenabled tools responsibly and effectively for research analysis content creation problemsolving operational tasks and achieving business outcomes

About Micron Technology Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich lifefor all. With a relentless focus on our customers technology leadership and manufacturing and operational excellence Micron delivers a rich portfolio of high-performance DRAM NAND and NOR memory and storage products through our Micron and Crucial brands. Every day the innovations that our people create fuel the data economy enabling advances in artificial intelligence and 5G applications that unleash opportunities from the data center to the intelligent edge and across the client and mobile user experience.

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