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Senior Quantum 3D Integration and Packaging Engineer

Applied Materials


Job Location:

Singapore - Singapore

Monthly Salary: Not provided by the employer
Posted: 5 September 2026 (23 hours ago)
Application Deadline: 3 December 2026
Vacancies: 1 Vacancy

Job Summary

Who We Are


Applied Materials is the global leader in materials science and engineering solutions that are at the foundation of virtually every new semiconductor chip and advanced display in the world. The equipment that we create and service is essential to advancing AI and accelerating the commercialization of next-generation semiconductor chips. Join us and push the boundaries of materials science and engineering in a company at the foundation of the electronics industry. The work we do together advances the worlds technology.


What We Offer


Location:

SingaporeSGP

Youll benefit from a supportive work culture that encourages you to learn develop and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possiblewhile learning every day in a supportive leading global company. Visit our Careers website to learn more.

At Applied Materials we care about the health and wellbeing of our employees. Were committed to providing programs and support that encourage personal and professional growth and care for you at work at home or wherever you may go. Learn more about our benefits.

As a Process Engineer youll play a crucial role in designing and optimizing manufacturing processes for display and semiconductor manufacturing technologies. You will collect and analyze data perform hardware characterization and troubleshoot engineering issues. Youll also measure film properties generate technical documentation and engage with customers to resolve concerns. Process Engineers collaborate with vendors and suppliers and become familiar with implementing new technologies and products. You will experiment learn and collaborate with some of the brightest minds in the semiconductor and display industries partnering with our globally recognized R&D teams on state-of-the-art research and development projects.

At Applieds CTO group we focus on solid-state solutions for quantum technology i.e. superconducting qubits and optical quantum computing. Our primary objective is to collaborate with system companies and universities to develop quantum devices with significantly lower error rates compared to current standards. Our approach centers on harnessing state of the art materials engineering and semiconductor processing as well as our expertise in advanced (metasurface-based) optics to enhance device performance.

To achieve this goal were seeking a passionate technologist with strong semiconductor and 3D integration background to develop advanced packaging solutions for emerging markets and new technology inflection on quantum information. We value our people and teams who turn possibilities into reality. We are deeply committed to fostering a Culture of Inclusion where every person knows they belong feels empowered to bring their whole self to work and is inspired to grow.

Responsibilities

  • Create 3D integration and packaging solutions for different platforms and quantum structures

  • Work with advanced packaging process hardware and metrology team to develop new materials processes and structures for quantum devices

  • Design collect data analyze and compile reports on a variety of difficult process engineering experiments within safety guidelines

  • Troubleshoot a variety of complex problems perform Root Cause Analysis and resolve a variety of difficult process engineering issues

  • Generate internal and external documentation for products presentations and technical reports

  • Design and conduct experiment measure material and device properties and interpret data

  • Keep up to date with the latest advancements in 3D integration quantum information and related fields to continually implement new technologies enhance approaches and develop methodologies

  • Collaborate with customers start-ups or universities to identify key problems and develop enabling solutions

Requirements

  • PhD Masters or Bachelors degree in Materials Science Electrical Engineering Physics Microelectronics or a related field.

  • 5 years of experience in advanced packaging 3D integration heterogeneous integration or semiconductor process development.

  • Strong knowledge of wafer-level packaging hybrid bonding TSV chiplets flip-chip and related packaging technologies.

  • Hands-on experience in semiconductor fabrication process integration materials characterization and metrology.

  • Experience with DOE data analysis process optimization and root cause analysis.

  • Familiarity with quantum devices superconducting technologies photonics or cryogenic systems is a strong plus.

  • Strong problem-solving technical communication and cross-functional collaboration skills.

  • Ability to work effectively with customers startups universities and multidisciplinary R&D teams.

Work Location

  • Science Park II (Moving to Tampines office starting May 2027)

Additional Information

Time Type:

Full time

Employee Type:

Assignee / Regular

Travel:

Relocation Eligible:

No

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race color national origin citizenship ancestry religion creed sex sexual orientation gender identity age disability veteran or military status or any other basis prohibited by law.


Required Experience:

Senior IC


About Company

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Applied Materials, Inc. is the global leader in materials engineering solutions for the semiconductor, flat panel display and solar photovoltaic (PV) industries.

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