Senior Member of Technical Staff (Advanced Packaging Pathfinding)

Who We Are

Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips the brains of devices we use every day. As the foundation of the global electronics industry Applied enables the exciting technologies that literally connect our world like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology join us to deliver material innovation that changes the world.

What We Offer

Location:

SingaporeSGP

Youll benefit from a supportive work culture that encourages you to learn develop and grow your career as you take on challenges and drive innovative solutions for our customers. We empower our team to push the boundaries of what is possiblewhile learning every day in a supportive leading global company. Visit our Careers website to learn more.

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As a Process Engineer youll play a crucial role in designing and optimizing manufacturing processes for display and semiconductor manufacturing technologies. You will collect and analyze data perform hardware characterization and troubleshoot engineering issues. Youll also measure film properties generate technical documentation and engage with customers to resolve concerns. Process Engineers collaborate with vendors and suppliers and become familiar with implementing new technologies and products. You will experiment learn and collaborate with some of the brightest minds in the semiconductor and display industries partnering with our globally recognized R&D teams on state-of-the-art research and development projects.

Senior Member of Technical Staff (Advanced Packaging Pathfinding)

This role is responsible for driving pathfinding and early-stage technology development for N2 and beyond advanced packaging architectures as a senior individual contributor. The position focuses on disruptive innovation deep technical problem-solving and concept-to-feasibility execution shaping future integration solutions and enabling new value creation opportunities.

The SMTS will operate at the intersection of technology innovation customer roadmaps and ecosystem collaboration translating emerging concepts into scalable differentiated capabilities aligned with Applied Materials long-term strategy.

Disruptive Pathfinding & Technology Development

• Drive long-range (N2 and beyond) pathfinding exploration in advanced packaging identifying key inflection points in interconnect scaling materials and integration architectures.

• Lead hands-on development and feasibility studies for novel packaging concepts including but not limited to D2W RDL CoWoS TSV and heterogeneous integration schemes.

• Develop and validate new integration approaches (e.g. mixed interconnect architectures advanced bumping strategies next-gen substrates).

• Perform deep technical analysis and trade-off assessments to guide design process integration and technology selection decisions.

• Contribute to make/buy/partner evaluations through technical insights and benchmarking of emerging solutions.

Technical Innovation & Execution

• Own key technical modules or integration challenges within pathfinding programs driving concept-to-demonstration execution.

• Design and execute experiments simulations and test vehicles to validate new ideas and reduce technical risk.

• Develop scaling frameworks and designprocess co-optimization strategies to meet future performance cost and reliability requirements.

• Translate innovative concepts into clear technical deliverables including models prototypes and demonstration vehicles.

• Document and communicate findings to influence technology roadmap decisions and downstream development programs.

Customer & Market Alignment

• Engage with internal and external stakeholders to translate customer requirements and system trends (AI HPC memory integration chiplets) into actionable technical problems.

• Identify latent technical challenges and gaps in current packaging approaches and propose novel solutions.

• Contribute to value proposition development by linking technical innovation to performance cost and scalability benefits.

Ecosystem Collaboration

• Work closely with materials suppliers equipment teams OSATs foundries and research partners to co-develop and validate new technologies.

• Support joint development efforts and early-stage collaborations contributing technical expertise and insights.

• Leverage ecosystem capabilities to accelerate learning cycles and de-risk new concepts.

Program Contribution & Technical Leadership

• Contribute to early-stage governance and decision frameworks by providing data-driven technical recommendations.

• Influence cross-functional teams (process product integration) to align on technology direction and development priorities.

• Develop executive-ready technical narratives that clearly articulate innovation value risks and trade-offs.

• Mentor junior engineers and contribute to building technical depth and innovation culture within the team.

Leadership Expectations

• Deep Technical Expert: Recognized for strong domain expertise in advanced packaging and integration.

• Innovation Driver: Generates and executes breakthrough ideas with measurable technical impact.

• Influencer: Drives alignment and decisions across teams without formal authority.

• Problem Solver: Thrives in ambiguity breaking down complex challenges into actionable solutions.

• Collaborator: Effectively works across organizational and ecosystem boundaries.

Core Qualifications

• 1015 years of experience in semiconductor technology with strong exposure to advanced packaging process integration or related domains.

• Demonstrated experience in technology development pathfinding or exploratory R&D.

• Strong understanding of advanced packaging technologies (RDL TSV CoWoS hybrid bonding etc.).

• Proven ability to solve complex technical problems and translate concepts into experimental validation.

• Strong communication skills to articulate technical insights and business relevance.

Preferred Qualifications

• Advanced degree (MS/PhD) in Materials Science Electrical Engineering Mechanical Engineering Physics or related field.

• Experience in heterogeneous integration chiplet architectures or next-generation interconnect technologies.

• Track record of innovation (patents publications or first-of-a-kind solutions).

• Familiarity with designprocess co-optimization and system-level trade-offs.

Impact

• Enable next-generation advanced packaging innovations through hands-on technical leadership.

• Influence Applied Materials long-term packaging technology roadmap.

• Deliver differentiated technical capabilities that support future product platforms and customer engagements.

Work Location

• Science Park II (Moving to Tampines in Dec 2026)

Additional Information

Time Type:

Full time

Employee Type:

Assignee / Regular

Travel:

Yes 20% of the Time

Relocation Eligible:

Yes

Applied Materials is an Equal Opportunity Employer. Qualified applicants will receive consideration for employment without regard to race color national origin citizenship ancestry religion creed sex sexual orientation gender identity age disability veteran or military status or any other basis prohibited by law.