Process Engineer – Plating Wet

Responsibilities:

Plating Process Engineering

Develop implement and optimize electroplating processes (e.g. Cu Ni SnAg etc.)

Monitor plating bath performance through regular analysis and corrective actions

Perform DOE capability studies and process qualification for new plating chemistry or equipment

Lead troubleshooting activities for plating defects such as voids roughness nodule formation non-uniformity and poor adhesion

Establish and maintain plating process parameters SOPs and control plans

Wet Process Support (Etching Cleaning Stripping)

Support wet etching processes (acid alkaline micro-etch) and ensure etch rate stability and uniformity

Optimize surface preparation steps prior to plating such as micro-etch oxide removal and plasma/aquatic cleaning

Monitor and sustain wet chemistry tanks (etchants cleaners developers strippers) through SPC and scheduled chemical analysis

Drive root-cause analysis for wet process issues including over-etch under-etch residue or surface contamination

Laboratory Support

Conduct chemical titration CVS TOC and other plating bath analytical methods

Prepare samples test coupons and run lab-scale plating and etching experiments

Support failure analysis through cross-sectioning microscopy (SEM/OM) and surface characterization

Maintain calibration and good housekeeping of lab tools chemical inventory and safety compliance

Yield Improvement & Quality

Analyze process data to identify trends and drive yield improvement actions

Support customer audit requirements documentation and technical reporting

Collaborate with Quality Production and R&D teams to resolve product or process quality issues

Equipment & Safety

Support installation preventive maintenance and troubleshooting of plating and wet process equipment

Ensure compliance with EHS guidelines for chemical handling waste disposal ventilation and PPE usage

Participate in safety risk assessments for chemical operations

Requirements:

Degree in Chemical Engineering Materials Engineering Chemistry or related technical field

Experience in electroplating Semiconductor packaging or chemical wet processes preferred

Knowledge of plating chemistry solution analysis and surface finishing technologies

Familiarity with SPC DOE FMEA and root-cause analysis tools

Strong analytical documentation and problem-solving skills