MEMS Fab Process Development Engineer (Dry Etch)

Description -

What a Dry Etch Process Engineer does in HP include:

• Own and sustain dry etch processes for silicon and oxide etching modules to support high-volume manufacturing and new product introduction (NPI).
• Drive process optimization defect reduction yield improvement and process robustness through data analysis DOE and continuous improvement projects.
• Investigate process excursions yield loss and defectivity issues using structured problem-solving methodologies and implement effective corrective and preventive actions.
• Develop and maintain process control plans SPC monitoring OCAPs specifications and process documentation.
• Collaborate closely with equipment engineers to resolve process-related equipment issues and establish effective process monitoring strategies.
• Lead process characterization qualification and release activities for new products materials consumables and process changes.
• Support process transfer technology development and process integration activities across engineering and manufacturing teams.
• Analyze process performance data and drive improvements in critical process metrics including yield defectivity process capability and throughput.
• Work closely with cross-functional teams including Process Integration Manufacturing Equipment Engineering Quality and Product Development to achieve business objectives.
• Provide technical guidance and training to technicians and manufacturing personnel on process operation troubleshooting and best practices.
• Support quality and compliance audits to ensure process and documentation adherence to internal and external requirements.

Individuals who will do well in the role usually possess:

• Bachelors or Masters Degree in Chemical Engineering Materials Science Mechanical Engineering Electrical Engineering Physics or related disciplines.
• Minimum 25 years of hands-on semiconductor wafer fab experience in dry etch process engineering.
• Strong knowledge of plasma etching fundamentals particularly silicon etch oxide etch and profile control. Experience with process development process characterization DOE SPC and statistical data analysis.
• Experience supporting high-volume manufacturing with demonstrated success in yield improvement and defect reduction projects.
• Familiarity with semiconductor process integration and interactions between dry etch and upstream/downstream process modules.
• Experience with process troubleshooting using engineering methodologies such as 8D DMAIC or root cause analysis techniques.
• Knowledge of process control systems FDC APC SPC and process monitoring methodologies is advantageous.
• Strong analytical and problem-solving skills with the ability to handle complex technical challenges independently.
• Good communication presentation and technical documentation skills. Self-motivated proactive and able to work effectively in a fast-paced manufacturing environment.
• Good team player with strong collaboration skills across global and cross-functional teams.

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Equal Opportunity Employer (EEO) -

HP Inc. provides equal employment opportunity to all employees and prospective employees without regard to race color religion sex national origin ancestry citizenship sexual orientation age disability or status as a protected veteran marital status familial status physical or mental disability medical condition pregnancy genetic predisposition or carrier status uniformed service status political affiliation or any other characteristic protected by applicable national federal state and local law(s).

Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.

For more information review HPsEEO Policy or read about your rights as an applicant under the law here: Know Your Rights: Workplace Discrimination is Illegal