Engineer – Wafer Bumping Equipment

Engineer Wafer Bumping Equipment (PVD/ Descum/ Wet)

Responsibilities:

Lead Equipment support team for in depth technical analysis

Carry out effective planning for CM and PM (inclusive of system setup)

Maintain high equipment reliability with minimal resource requirement

Equipment startup installation and maintenance

Troubleshooting and provide upgrade or improvement to the equipment

Analyze equipment failure mode and carry out continuous improvement plan

Liaising and negotiating with external party on parts enquiry and quotation

Provide training and guidance to subordinates

Participate OEE and capacity improvement projects

Generating OPL and operational procedure and document in support of QMS documentation

Parts tracking and ordering base on system

Vendor negotiation on support and parts inventory

ESD system setup and monitoring for all system

Risk assessment for existing and new system

Smart factory support and maintenance (AMR CDS system maintenance)

Requirements:

Degree in Engineering preferably Mechanical Electrical Electronics

3 years of relevant experience preferably in semiconductor industry

Good problem-solving skills and communication skills