Die Clip Attach Technical Expert

As a Die / Clip Attach Technical Expert you will be responsible for developing and implementing competitive technical solutions across semiconductor manufacturing processes including Pre-Assembly Die Bond Wire Bond Mold and related areas.

You will play a key role in driving equipment strategy introducing advanced technologies resolving complex technical challenges and enhancing manufacturing performance in terms of cost quality and capability.

This role requires strong technical expertise project leadership and close collaboration with cross-functional and international teams to support factory objectives and future package R&D roadmaps.


What You Will Do

Equipment & Technology Strategy

• Define and drive equipment strategies aligned with factory and package R&D roadmaps

• Evaluate and select new equipment technologies for manufacturing processes

• Lead equipment introduction and qualification projects
  

Process Improvement & Technical Leadership

• Solve complex and chronic technical issues in manufacturing

• Drive improvement projects to enhance productivity process capability quality and cost efficiency

• Develop and maintain process standards and design rules
  

Benchmarking & Best Practices

• Conduct cross-site benchmarking activities

• Implement best practices across manufacturing sites

• Scout and evaluate state-of-the-art technologies and industry solutions
  

Project Management & Collaboration

• Lead technical projects involving cross-functional and international teams

• Prepare technical reports capability studies and roadmaps

• Work closely with R&D production quality and engineering teams
  

Industry & Market Awareness

• Stay updated on the latest semiconductor equipment and process technologies

• Build and maintain strong industry networks with suppliers and technology partners

What You Will Need

• Bachelors or masters degree in engineering or a related discipline

• Minimum 10 years of experience in semiconductor manufacturing and process engineering

• Strong technical expertise in process and/or equipment engineering within semiconductor assembly operations

• Proven experience in equipment selection qualification optimization and technology introduction

• Strong analytical thinking with excellent troubleshooting and problem-solving capabilities

• Ability to work independently and drive improvement initiatives proactively

• Strong communication and presentation skills with the ability to engage stakeholders effectively

• Experience leading technical and cross-functional projects in a manufacturing environment

• Strong leadership influencing and stakeholder management skills

• Detail-oriented with a structured and systematic working approach

Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright material and the word Nexperia is a registered trademark.

D&I Statement

As an equal-opportunity employer Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all and we consider all applicants fairly as well as providing a safe work environment and reasonable adjustments where requested.

In addition we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Womens groups. Nexperia is committed to increasing women in management positions to 30% by 2030.