Description:
**Please note: This is 100% on site role and candidates must be local.
Laptop will be issued
The candidate will be responsible for conducting failure analysis needed identify electrical & thermal mechanical package failures and supporting root cause understanding of new package technologies being developed.
Knowledge of packaging material property and behavior is beneficial.
Candidate should also demonstrate good communication skills work well with a team deliver under pressure and well organized.
Preferred skills:
Demonstrated skills in Xsection/planar polishing Optical microscopy imaging Labview and SEM imaging on printed circuit board are preferred.
Minimum Educational Requirement: BS degree or higher in science or engineering and 8 years experience in failure analysis material analysis process development or analytical tool development.
Additional Details
- Managers Requested Bill Rate : 62.80
- Does the position allow for the worker to be virtual/remote : No
- Shore Options Available for this Position : Onshore Only
- Critical Position : No
- PO Number (Intel Federal and Construction Only) : Enter PO here if applicable
- Shift Hours : 8am5pm
- Shift Days : MondayFriday
- Intel Specific Job Title : (No Value)
- Project ID : Enter Project ID