Field Application Engineer

The company:
We are an innovative functional materials and innovative device leader with a company size of 400. We are focused on integrated research and development manufacturing and sales of EMI shielding materials thermal interface materials waveabsorbing materials and ferrite.

The company owns subsidiaries in Chongqing Zhejiang with offices around the globe in places such as the United States Japan Hong Kong Taiwan and now in Malaysia.

Job Description

• Collaborate with sales to understand market application requirements and provide thermal interface material selection for chip packaging customers.
• Identify potential customer needs and provide design solutions.
• Assist customers in solving thermal interface material packaging process issues and continuously optimize them.
• Track the entire process of thermal interface material application from NPI (New Product Introduction) to final mass production at packaging factories.
• 10 years experience in related roles with experience in semiconductor packaging preferred.

Job Requirements

• Masters degree or above in semiconductor mechanical design applied electronics or related fields such as polymer materials.
• Proficient in analog circuit and digital circuit theory be able to understand design application diagrams.
• Familiar with the application of thermal interface materials.
• Strong selflearning and critical thinking abilities.
• Good execution skills and communication support capabilities.
• Proactive with a strong sense of responsibility ability to handle pressure and a spirit of teamwork.

Remuneration:
MYR 8000 MYR 15000

Consultant In Charge:

Phoebe Loke

8k15k( or discuss personally) 0.5% sales commissions 300MYR fix allowances allinclusive Annual Bonus

Remote Work :

No