Optical Packaging Engineer (Silicon Photonics)

We cant predict what the future holds but we know Texas Instruments will have a part in shaping it.

Kilby Labs is the advanced R&D and product development support organization within TI chartered to define and develop new and innovative technologies and solutions in collaboration with business units and customers. As a member of Kilby Labs youll have the chance to interact with many product groups and functions work with an interdisciplinary team and bridge from lab to fab to develop technologies to enable new markets.

About the Position

Kilby Labs is seeking a highly motivated and experienced Optical Packaging Engineer to lead the development and implementation of innovative packaging solutions for cutting-edge optical transceiver products including silicon-photonics-based optical sub assemblies pluggable transceivers optical engines and co-packaging of optics. The role requires industry experience with transmit and receive optical sub assembly package design and volume manufacturing as well as creative problem-solver who can develop unique breakthrough technologies that leap-frog the state-of-the-art as well as contribute across various aspects of a project depending on program needs.

Responsibilities may include but are not limited to:

• Own transmit and receive optical sub assembly package designs for datacenter optical interconnect products jointly with partners and ensure they meet customer and partner requirements
• Define and develop new optical interconnect sub assembly packaging designs and approaches to meet future product and system roadmap needs including for advanced silicon photonics products.
• Develop solutions for low-loss low-cost and high density scalable fiber attach solutions to silicon photonics and fiber-to-chip packaging solutions.
• Perform multiphysics modelling of optical thermal and/or mechanical properties and performance.
• Lead integrity and yield analysis and drive improvement/corrective actions for silicon process and semiconductor assembly packages utilizing appropriate tools.
• Plan and execute process optimization characterization design validation and failure analysis.
• Collaborate with external partners to realize packaging solutions and manage vendor relationships.
• Consider cost effectiveness and perform cost effectiveness studies develop and introduce package cost reduction programs.
• Maintain product quality develop and lead package qualification programs.
• Ensure mass production readiness by collaborating with engineering and operations teams.
• Present work and findings to internal and external stakeholders.
• Masters degree or higher in electrical engineering mechanical engineering material science or related field.
• Experience in TOSA/ROSA package development including design and device/module qualification.
• Experience with manufacturing methods and technologies for attachment of optical fibers to semiconductor chips.
• Understanding in semiconductor packaging technology including die attach wire bonding flip-chip and micro-optics.
• Knowledge of industry optical packaging competitive landscape trends industry standards supply chain manufacturing equipment and reliability requirements.
• Demonstrated analytical and problem-solving skills.
• Experience with fiber handling fiber cleaving wet processing fiber connectors.
• Experience with Optical and electro-optical characterization and probing.
• Experience with automated test setups for wafer/ die scale electro-optical measurements through Python or any other language and motion controllers.
• Experience designing and developing Heterogenous Integration (HI) assembly processes for photonic and electronic integration.
• Understanding of the end applications related optical networking including pluggable modules and co-packaged optics.
• Strong verbal and written communication skills.
• Ability to work in teams and collaborate effectively with people in different functions.
• Ideal candidate must also excel at promoting new ideas building collaborative relationships working across organizations.

Minimum Requirements:

• Masters degree or higher in electrical engineering mechanical engineering material science or related field.
• Experience in TOSA/ROSA package development including design and device/module qualification.
• Experience with manufacturing methods and technologies for attachment of optical fibers to semiconductor chips.
• Understanding in semiconductor packaging technology including die attach wire bonding flip-chip and micro-optics.
• Knowledge of industry optical packaging competitive landscape trends industry standards supply chain manufacturing equipment and reliability requirements.
• Demonstrated analytical and problem-solving skills.

Preferred Requirements:

• Experience with fiber handling fiber cleaving wet processing fiber connectors.
• Experience with Optical and electro-optical characterization and probing.
• Experience with automated test setups for wafer/ die scale electro-optical measurements through Python or any other language and motion controllers.
• Experience designing and developing Heterogenous Integration (HI) assembly processes for photonic and electronic integration.
• Understanding of the end applications related optical networking including pluggable modules and co-packaged optics.
• Strong verbal and written communication skills.
• Ability to work in teams and collaborate effectively with people in different functions.
• Ideal candidate must also excel at promoting new ideas building collaborative relationships working across organizations.