Senior Packaging Engineer (Power Module)

Change the world. Love your job.
As a Packaging engineer you will enjoy an environment of smart collaboration with a global team of the industrys top engineering minds at your disposal. TIs corporate culture is one of competitive spirit which fuels continued business growth and constant career opportunities. While ethical business practice is a central aspect of the work place-you will be treated with respect dignity kindness and courtesy.

2 available positions:

1. Power Module
   1. Optimizing and establishing robust and high-speed process parameters for various component attach processes stack-up and molding (transfer or compression) technology
   2. Defining simplified manufacturing process sequence for different components attach
   3. Broad and deep technical understanding of PCB / Substrate / Laminate / MIS manufacturing.
2. Leaded Module
   1. Optimizing and establishing robust and high-speed process parameters for multi chip attach processes stack-up and wire bonding technology
   2. Defining simplified manufacturing process sequence for power stage package
   3. Broad and deep technical understanding of leadframe / DBC / MIS manufacturing.

Responsibilities Include:

• Managing multiple new product executions starting from kick-off product prototyping characterization learning cycles and qualifications until product released with engineering approach such as JMP analysis FMEA control plan etc.
• Collaborate closely with factory operations teams to meet manufacturing indices quality standards and cost entitlements
• Engaging with global package platform and emerging technology team to execute differentiated technology roadmaps to establish process capabilities in front of needs
• Enabling TI power modules package competitiveness through adopting the industry latest greatest capabilities and maximize package design flexibility for adapting the latest technology.
• Work with multi function to enable stress modeling to understand the package design weak point and define the contingency plan to overcome it.

Minimum requirements:

• Bachelors degree in Mechanical Engineering Physics Material Science or a related field of study
• Minimum 5 years-experience in the semiconductor field
• Expert level experience in process development for power stage multi chip module.
• Package layer design expertise such as structural configuration material selection and process flow design
• Hands on skills in operating machines and knowledge to down-select material process optimization and yield improvement
• Expert experience of using ANSYS / FEA for stress modeling.

Preferred qualifications:

• Ability to engage with a geographically diverse team with a strategic vision to drive a complex technology roadmap.
• Hands on experience on system-in-Package (SiP) including multi chip package or package on package is added advantage.
• Knowledge of power stage packaging design including understanding of Design for Manufacturability (DFM) constraints and defect criteria.
• Experience in multi-process coordination and optimization (integration between SMT and back-end packaging processes)

• Ability to establish strong and collaborative relationships with stakeholders global design & manufacturing teams and component/material/substrate supplier to meet on-time execution

• Knowledge in FMEA methodology process control plan statistical analysis SPC and DOE methodology. Skilled in JMP statistical analysis software is an added advantage
• Experience with assembly of power modules packaging substrate design and reliability requirements
• Project management experience in semiconductor industry specifically in Assembly Test or SMT Operation
• Key personal characters trustworthy inclusive innovative competitive result-oriented