Your contribution to something big:
- Topic: Investigation of Cu-pillar Underfill for Semiconductor Applications.
- State-of-the-art Review of Underfill in the semiconductor industry;
- Identification of relevant material properties and influence on reliability;
- Material Characterization (Thermal analysis Rheology Chemical analysis DMA and TMA);
- Shear/adhesion strength method implementation in Bosch BrgP;
- Definition of test method for Nano-identation measurements in Bosch BrgP.
These tasks are planeed to be conducted collaboratively both within Bosch BrgPs laboratory and production environments and at University of Minho for further testing (e.g. DMA TMA) .
Qualifications :
What distinguishes you:
- Knowledge in materials characterization techniques chemical analysis and material science;
- Knowledge in testing and statistical methods;
- Prefered high knowledge in Materials Engeneering and mechanical;
- Proficiency with Microsoft Office tools;
- Experience in lab environment (mandatory);
- Good written and verbal communication skills in English (mandatory);
- Team working and colaboration ability;
- Adaptability and Flexibility;
- Critical thinking and problem solving skills;
- Communicative responsible and time management/organization skills.
Additional Information :
Work #LikeABosch includes:
Exchange with colleagues around the world
Medical office (psychology and general clinic) & Social Services Office on site
Training opportunities (p.e. technical training foreign languages training)
Continuous professional development
Access to great discounts in partnerships and Bosch products
Sports and health related activities
Great access to public transports
Free transport from Porto
Free parking lot
Canteen
Success stories dont just happen. They are made...
Make it happen! We are looking forward to your application!
Remote Work :
No
Employment Type :
Full-time
Your contribution to something big:- Topic: Investigation of Cu-pillar Underfill for Semiconductor Applications.State-of-the-art Review of Underfill in the semiconductor industry;Identification of relevant material properties and influence on reliability;Material Characterization (Thermal analysis ...
Your contribution to something big:
- Topic: Investigation of Cu-pillar Underfill for Semiconductor Applications.
- State-of-the-art Review of Underfill in the semiconductor industry;
- Identification of relevant material properties and influence on reliability;
- Material Characterization (Thermal analysis Rheology Chemical analysis DMA and TMA);
- Shear/adhesion strength method implementation in Bosch BrgP;
- Definition of test method for Nano-identation measurements in Bosch BrgP.
These tasks are planeed to be conducted collaboratively both within Bosch BrgPs laboratory and production environments and at University of Minho for further testing (e.g. DMA TMA) .
Qualifications :
What distinguishes you:
- Knowledge in materials characterization techniques chemical analysis and material science;
- Knowledge in testing and statistical methods;
- Prefered high knowledge in Materials Engeneering and mechanical;
- Proficiency with Microsoft Office tools;
- Experience in lab environment (mandatory);
- Good written and verbal communication skills in English (mandatory);
- Team working and colaboration ability;
- Adaptability and Flexibility;
- Critical thinking and problem solving skills;
- Communicative responsible and time management/organization skills.
Additional Information :
Work #LikeABosch includes:
Exchange with colleagues around the world
Medical office (psychology and general clinic) & Social Services Office on site
Training opportunities (p.e. technical training foreign languages training)
Continuous professional development
Access to great discounts in partnerships and Bosch products
Sports and health related activities
Great access to public transports
Free transport from Porto
Free parking lot
Canteen
Success stories dont just happen. They are made...
Make it happen! We are looking forward to your application!
Remote Work :
No
Employment Type :
Full-time
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