Mobile Hardware and Chip-Level Repair Engineer (Contract – Immediate Joiner)
Share
Job Location:
Monthly Salary:
Posted on:
2 hours ago
Vacancies:
1 Vacancy
Job Summary
ob Title: Mobile Hardware and amp; Chip-Level Repair Engineer (Contract Immediate Joiner)
Location: Brookefield Bangalore (Onsite)
Job Type: Contract
Contract Duration: 7 to 15 Days
Joining: Immediate Joiner Required
Job Description:
We are looking for an experienced Mobile Hardware and amp; Chip-Level Repair Engineer for a short-term onsite contract in Brookefield Bangalore. The candidate must have complete knowledge of smartphone repair including hardware software soldering and motherboard-level repair. The candidate should be able to independently diagnose and repair Android and iPhone devices.
Key Responsibilities:
Diagnose and repair hardware and software issues in smartphones (Android and iPhone)
Perform chip-level repair including soldering and micro-soldering
Repair motherboard issues IC replacement and circuit repair
Replace display battery charging port speaker microphone and camera
Repair damaged connectors and soldering connections
Handle water-damaged devices repair
Perform software flashing OS installation and firmware updates
Test devices after repair to ensure proper functionality
Required Skills:
Strong experience in mobile hardware and chip-level repair
Expertise in soldering hot air gun and motherboard repair
Knowledge of Android and iPhone repair
Experience using tools like soldering station microscope multimeter
Ability to work independently
Experience Required: 1 Years (Preferred)
Work Location: Brookefield Bangalore (Onsite)
Immediate Joiners Only
Company Industry
IT Services and IT Consulting
Key Skills
- Catering
- Computer Data Entry
- Marketing & Operations
- Application Engineering
- Hospital
