Electronics Package Design Engineer

Ronkonkoma, NY - USA

Monthly Salary: Not Disclosed

Posted on: 30+ days ago

Vacancies: 1 Vacancy

Job Summary

We are seeking an experienced Electronics Packaging Design Engineer to join our this role you will lead the design of advanced packaging solutions including flip-chip BGA ceramic packages multi-chip modules (MCMs) and system-in-package (SiP) architectures. Youll collaborate with cross-functional teams and suppliers to deliver reliable manufacturable and cost-effective designs.

Responsibilities:

Design interconnects substrate stack-ups routing strategies and package layouts.
Verify designs against electrical thermal mechanical and manufacturability requirements.
Partner with suppliers and internal teams to align designs with process capabilities.
Support failure analysis and root-cause investigations.
Document design processes and lead reviews from concept to release.
Mentor junior engineers and support packaging technology roadmaps.

Qualifications

Bachelors in Electrical Engineering Materials Science or related field.
8 years in IC/electronic packaging design.
Proficiency with Cadence Allegro or equivalent tools.
Expertise in advanced packaging (2.5D/3D interposers HBM fan-out WLP wire bond flip chip stacked die ceramic co-fire encapsulated modules/BGAs).
Strong knowledge of substrate technologies and manufacturing processes.
Excellent problem-solving and communication skills.

Preferred: Experience with OSATs/foundries high-speed digital interfaces (PCIe DDR SerDes) package-level simulation tools and defense packaging for extreme environments.

Why is This a Great Opportunity

Well-established stable company. Long-term projects featuring great technology. They are a great team of people to work with.