Assembly Engineering Director

Kaohsiung City - Taiwan

Monthly Salary: Not Disclosed

Posted on: 15 hours ago

Vacancies: 1 Vacancy

Job Summary

Role Summary:

leading and managing all the activities of Assembly Process in AT Kaohsiung working together with various groups (particularly Manufacturing Equipment and Packaging Innovation) to meet business objectives.

Job Responsibility:

Management Team member of NXP Kaohsiung to drive site decision aligning with NXP values and mission.
Drive process standardization best practices and talent retention & growth for organization sustainability
Establishing & maintaining the production standard work meeting process control requirements
Own & drive area KPIs to meet performance target (Safety Quality Delivery Costs Yield)
Define develop and establish process capabilities strategy and roadmap
Develop a strategy to develop new capabilities or to overcome process constraints
Collaborate with Innovation NPI/NTI team to enable successful NPI/NTI launch with robust Safe Launch closure
Attend and own all BCAM related review on NPI/NTI to ensure risk to process margin/manufacturability is mitigated upfront
Constantly on the lookout for new material suppliers / new technology and capability
Specifically on risk assessment and process flow optimization playing the Integrator role of Assembly process from wafer to package finished good
Ensure business continuity in process working with Purchasing to identify critical suppliers and develop 2nd sourcing strategy
Maintain a matrix on process capabilities and constraints
Work with UG/Equipment counterpart on equipment benchmarking

Job Qualification:

Bachelor Degree in relevant engineering fields
15 Years of Experience in Semiconductor industry is mandatory
Competent in NPI development quality or problem solving skill will be added advantage
Experience with various DOE methodology proficient in statistical tools for decision making knowledgeable in JMP software or equivalent
Knowhow in wire bond technology including bonding diagram analysis Cu wire bonding and engagement with equipment team on Wirebonder MTBA improvement
Experience in running engineering teams in wire bond die bond or mold
Strong leadership skills with good communication
Excellent data analysis and data interpretation skills
Ability to make sound data-driven decisions
Hands on strong ownership and able to collaborate as team player

More information about NXP in Greater China...

#LI-6a60

Required Experience:

Director

Role Summary: leading and managing all the activities of Assembly Process in AT Kaohsiung working together with various groups (particularly Manufacturing Equipment and Packaging Innovation) to meet business objectives.Job Responsibility: Management Team member of NXP Kaohsiung to drive site decisio...