Research Associate (High Temperature-Resistant & Miniaturized Payload Hardware Design)
Research Associate (High Temperature-Resistant & Miniaturized Payload Hardware Design)
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Job Description
Centre for Advanced Robotics Technology Innovation (CARTIN) are looking for a hardware-focused Research Associate to design and prototype a compact and heat-resistant multi-sensor payload. The system must withstand temperatures of 250C for 10 minutes (without external cooling) while maintaining internal stability for embedded electronics.
Key Responsibilities:
Design compact mechanical housing to operate under 250C ambient conditions.
Ensure internal core temperature remains under 55C during runtime.
Select and integrate miniaturized components (compute battery sensors).
Strip sensor casings and reassemble into a custom mount with thermal shielding.
Perform heat simulation thermal insulation and shock-resistance design.
Test hardware in specified sites and environments.
Job Requirements:
Bachelor or Master in Mechanical Engineering Mechatronics or similar.
Strong experience in heat-resistant enclosure design and miniaturized hardware integration.
Familiar with thermal simulation tools (ANSYS SolidWorks etc.).
Experience with IP65/ IP67 standards fanless computing and embedded design.
Knowledge of fire-fighting robot or harsh-environment robotic platforms is a plus.
Join our team to build a compact and thermally protected SLAM sensor payload for extreme environments. The candidate will design hardware that survives 250C conditions while maintaining internal electronics <55C. Experience with high-temp materials mechanical CAD and embedded platform integration is essential. Ideal for Mechatronics/Mechanical engineers with strong prototyping skills.
We regret to inform that only shortlisted candidates will be notified.
Hiring Institution: NTURequired Experience:
IC
Employment Type
Full-Time
