Lead Electro Mechanical Packaging Design & Analysis Engineer

Company:

Overview

As a leading global aerospace company Boeing develops manufactures and services commercial airplanes defense products and space systems for customers in more than 150 countries. As a top U.S. exporter the company leverages the talents of a global supplier base to advance economic opportunity sustainability and community impact. Boeings team is committed to innovating for the future leading with sustainability and cultivating a culture based on the companys core values of safety quality and integrity.

Technology for today and tomorrow

The Boeing India Engineering & Technology Center (BIETC) is a 5500 engineering workforce that contributes to global aerospace growth. Our engineers deliver cutting-edge R&D innovation and high-quality engineering work in global markets and leverage new-age technologies such as AI/ML IIoT Cloud Model-Based Engineering and Additive Manufacturing shaping the future of aerospace.

People-driven culture

At Boeing we believe creativity and innovation thrives when every employee is trusted empowered and has the flexibility to choose grow learn and explore. We offer variable arrangements depending upon business and customer needs and professional pursuits that offer greater flexibility in the way our people work. We also believe that collaboration frequent team engagements and face-to-face meetings bring together different perspectives and thoughts enabling every voice to be heard and every perspective to be respected. No matter where or how our teammates work we are committed to positively shaping peoples careers and being thoughtful about employee wellbeing.

With us you can create and contribute to what matters most in your career community country and world. Join us in powering the progress of global aerospace.

Summary:

The Boeing India Engineering and Technology Center (BIETC) is looking for a Lead Electronics Packaging Design & Analysis Engineer for a key role in development of a growing business unit. The position will be a hands-on technical role with responsibility ranging from printed circuit board design requirements chassis design and development thermal structural fatigue and materials selection detailed design documentation and analysis. The successful candidate should have a track record of demonstrated successes from previous work assignments.

This position will be based in Bangalore India.

Job Description:

• Lead product support engineering activities from mechanical for issue resolution during production. Will need to solve mechanical problems and possess the ability to proactively engage stakeholders towards resolution.
• Serve as the primary technical authority for electro-mechanical guiding troubleshooting efforts and implementing solutions for production and field issues.
• Apply advanced knowledge of mechanical principles (DFM DFA tolerance stack-ups stress thermal behavior) and foundational electronics understanding (PCB interface EMI/EMC grounding).
• Develop and execute structured technical plans to address product issues define priorities and allocate engineering resources effectively. Ensure planning is aligned with production timelines customer commitments and program milestones
• Represent mechanical engineering in Integrated Product Teams (IPTs) coordinating with design manufacturing quality and supplier management to address and resolve complex challenges.
• Collaborate with IPT teams to ensure mechanical provisions align with ESS assembly component layout vibration thermal connector orientation shielding and isolation needs.
• Work closely with supplier management teams to address technical issues manage technical queries drive quality improvements and ensure supplier compliance with technical specifications
• Collaborate with Chief Engineers and in-house subject matter experts for high-impact or critical product issues towards appropriate resolutions.
• Maintain a high level of technical acumen capable of deep diving into mechanical or electromechanical system-level problems. Apply systems think to correlate field failures to design decisions and original requirements.
• Conduct Root Cause Analysis (RCA) Troubleshoot and resolve complex mechanical and electromechanical issues in manufacturing and fielded units and implement Corrective and Preventive Actions (CAPA).
• Change Management: Oversee the creation and approval of Engineering Change Requests (ECRs) and Requests for Authorization of Change (RAC.s) ensuring documentation aligns with company standards and regulatory requirements (DO-160 AS9100).
• Develop mechanical design concepts for chassis enclosure PCB mounts to address system requirements weight cost and thermal constraints.
• Design Calculations: Perform design calculations stack up analysis machined chassis development and support in developing mechanical design concepts.
• Exposure and thorough understanding of Air Transport Avionics Equipment Interfaces ARINC & VITA Specification.
• Conduct DO-160 Qualification testing for Structural Thermal and other Environmental conditions.

Employer will not sponsor applicants for employment visa status.

Basic Qualifications (Required Skills/Experience)

• Bachelors degree or higher is required as a BASIC QUALIFICATION
• Must have Strong mechanical product design expertise with a focus on hands on experience in new product design and development of Electronic Line Replaceable Unit
• Preferred work experience in production support to resolve technical/Engineering issues during production
• Hands-on experience with root cause analysis techniques
• Experience working with multi-disciplinary teams including electrical systems and manufacturing engineering
• Excellent problem-solving skills and ability to make decisions under pressure
• Strong communication and collaboration abilities across internal and external stakeholders
• Understanding of GD&T thermal management fastener selection and enclosure design.
• Ability to interpret technical drawings BOMs and qualification reports.
• Experience in Mechanical Chassis design (End-to-End) for Machined/Sheet metal LRU and test equipment.
• Experience in Aerospace conducting DO-160 Qualification testing including preparation of Qualification Test Procedure and Reports.
• Experienced in Manufacturing of Machined and sheet metal components. Must have DFM/DFA and design for reliability exposure.
• Experience in detailed development and COTS selection of power and analog/control electronic printed circuit boards connectors modules chassis heat sink and mechanical fasteners.
• Preferably experience in Heat Sink Design Fan Selection TIM selection design for heat pipes component and System level cooling.

Typical Education & Experience:

Mechanical Engineering degree and 13 to 16 years of related work experience or a Masters degree and 12 to 15 years of related work experience.

Relocation:

This position does offer relocation within INDIA

Language Requirements:

Education:

Relocation:

Security Clearance:

Visa Sponsorship:

Contingent Upon Award Program

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