ASIC Package Design Engineer

Staff Smart Inc

Posted on : 03-07-2025

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1 Vacancy

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Job Location

Milpitas, CA - USA

Monthly Salary

Not Disclosed

Salary Not Disclosed

Vacancy

1 Vacancy

Posted on : 03-07-2025

Job Description

Description

Our customer is an innovative enterprise that designs develops and delivers System-on-Chip solutions for customers worldwide. The company focuses on AR/VR ADAS imaging networking data storage and other dynamic technologies that drive todays leading-edge applications. They combine world-class expertise experience and an extensive IP portfolio to provide exceptional solutions and ensure a better quality of experience for customers. Founded in 2015 they are headquartered in Yokohama and have offices in Japan Asia the United States and Europe to lead their product development and sales activities.

We are seeking an ASIC Package Design Engineer to work from our Milpitas CA office in a hybrid capacity.

Responsibilities

The Package Engineering function provides support expertise and insight to the Silicon device development team through preliminary activities of package selection routing techniques and necessary simulation work. The position involves diverse responsibilities including evaluation of new packaging technology package recommendation for custom devices substrate design support and device/package qualification. You will report to the Director of Package design (USA) and you will also work very closely with the Package/Manufacturing team in our headquarters (Japan) and the Marketing and Engineering teams located in our Santa Clara office during the pre- and post-sales process.

This position requires experience in the Fabless semiconductor model with a broad knowledge of package technology and manufacturing. Successful candidates will have a deep understanding of a variety of IC package technologies. and nbsp;
The candidate should possess specific experience in the following areas: and nbsp;
High-performance build-up substrates and nbsp;
Flip chip assembly or 2.5D packaging. and nbsp;
Knowledge of Chiplet technology
Optical integrated packages and nbsp;
Experience in extracting/simulating package designs for SI and PI using tools such as HFSS POWER SI and other leading tools.

Education

Bachelors degree in Electrical Engineering or other semiconductor packaging-related discipline

Required Experience and amp; Skills

8 to 10 years of experience in semiconductor packaging design and simulations
Record of success in a cross-functional team environment
Good experience with SI/PI tools for package-level extraction/simulation
Ability to work with Package Layout engineers
Strong presentation and communication skills

Preferred Experience and amp; Skills

Good knowledge of IC package materials and manufacturing

Compensation: $180000 - 220000 base salary DOE plus an excellent benefits package.

Applicants must be authorized to work for any U.S. employer.

Staff Smart Inc. is an Equal Opportunity Employer. All qualified applicants will receive consideration for employment without regard to race color religion sex pregnancy sexual orientation gender identity national origin age protected veteran status genetic information disability status or any other characteristic protected by law.

Employment Type

Full Time

Company Industry

Key Skills

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About Company

Staff Smart Inc

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ASIC Package Design Engineer

Staff Smart Inc

Job Description

Employment Type

Company Industry

Key Skills

About Company

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