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About Marvell
Marvells semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise cloud and AI automotive and carrier architectures our innovative technology is enabling new possibilities.
At Marvell you can affect the arc of individual lives lift the trajectory of entire industries and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation above and beyond fleeting trends Marvell is a place to thrive learn and lead.
Your Team Your Impact
Marvells semiconductor solutions are the essential building blocks of the accelerated data infrastructure that connects to the world. Marvell has the extraordinary opportunities across Data Center & AI Automotive Enterprise Storage and Carrier architectures where we deliver our strong product portfolios to the market.What You Can Expect
Define package guidelines and drive implementation in product design focusing on FC bumping RDL and wafer level package.
Manage and drive OSAT on package technical risk assessment design review BOM and process selection package characterization and qualification.
Fully in charge of NPI package related tasks starting from package definition first sample delivery package qualification and production ramp.
Work closely with internal cross functional teams and lead package development of NPI from concept to production.
Work with QA OSAT/substrate suppliers to resolve package related quality/reliability issues.
Work with procurement and suppliers on package cost analysis.
What Were Looking For
Experiences in semiconductor wafer level packaging is a must. Education: BS MS or PhD in ME MSE EE or related engineering fields.
BS with 510 years of experience
Prefer MS/PhD with 3 years of experience
Have passion for work; selfmotivated eager to learn and grow; be responsible and accountable; and result driven.
The ideal candidate has good knowledge of design rule process and materials used in FC bumping and wafer level packaging.
Good understanding of semiconductor IC packaging assembly processes materials reliability standards and failure analysis techniques.
Experiences in Si photonics packaging is a plus.
Basic KLayout Cadence APD and AutoCAD skills
Good communication skill is essential to work well with internal cross functional teams and external suppliers.
Good program management skills.
Ability to work independently with minimum supervision.
Expected Base Pay Range (USD)
$ per annumThe successful candidates starting base pay will be determined based on jobrelated skills experience qualifications work location and market conditions. The expected base pay range for this role may be modified based on market conditions.
Additional Compensation and Benefit Elements
At Marvell we offer a total compensation package with a base bonus and and financial wellbeing are part of the package. That means flexible time off 401k plus a yearend shutdown floating holidays paid time off to volunteer. Have a question about our benefits packages health or financial Ask your recruiter during the interview process.All qualified applicants will receive consideration for employment without regard to race color religion sex national origin sexual orientation gender identity disability or protected veteran status.
Any applicant who requires a reasonable accommodation during the selection process should contact Marvell HR Helpdesk at .
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