Packaging Systems interface Architect

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence inspiring the world to learn communicate and advance faster than ever.

As an Advanced Packaging and Systems Interface Architect in the Mobile Business Unit(MBU) you willlead pathfinding forMicronsAdvanced Packaging& Memory/Storage interconnect strategy anddriveinnovation to ensure a leadership portfolio andoutstandingproduct roadmap!

Opportunity to collaboratewiththe industrys leading technologists. Youwill collaborate withMicrons worldwidetalent that include research and development engineering salesmanufacturing and operations. As a part of this role you willhave the opportunity to directly interact withsenior executives on the product plans and its alignment to market needs!

Responsibilities will include but are not limited to:

• Develop and maintain positive relationships at key enablement partners and definitional customers

• Drive novel solutions with SoC architects silicon design and product teams to recommend the optimum package solutions to meet electrical mechanical thermal and other system level requirements.

• Coordinate package design and assembly of advanced 2.5D/3D packages driving material and BOM choices body sizes manufacturability and package constructions to achieve acceptable DFM requirements.

• Interface closely with Microns internal manufacturing andexternalpartners to productize advanced packaging solutions from concept to prototyping to mass production phases.

• Support and collaborate with customers to ensure that Microns products can meet their quality reliability system and operational needs.

Successful candidates for this position will have:

• Awareness of packaging roadmaps and business models across the hardware stack and services

• Excellent communication skills with the ability to convey complex technical concepts to both technical and nontechnical partners.

• Experience and solid understanding with 2.5D/3D heterogeneous integration technologies such as WLFO SoIC CoWoS WoW InFO and other chiplet/SiP architectures.

• Experience with wafer bumping package assembly substrate technology BOM selection testing and product development lifecycle.

• Experience with Mobile and smartphone signaling and packaging technologies and challenges

• Exposure to Mobile interfaces like LP5 LP6 and UFS technologies as it relates to packaging and SI/PI helpful.

• An established network with peers in the industry and relationships with key partners

• Strong publication record patents or contributions to industry standards desirable.

• Proven leadership experience in guiding multifunctional teams and driving technical perfection.

Required Experience:

• Bachelor/Master of Science in materials mechanical chemical or electrical engineering. MS or PhD preferred

• 10 years of proven experience

The US base salary range that Micron Technology estimates it could pay for this fulltime position is:

Our salary ranges are determined by role level and location. The range displayed on each job posting reflects the minimum and maximum target for new hire salaries of the position across all US locations. Within the range individual pay is determined by work location and additional jobrelated factors including knowledge skills experience tenure and relevant education or training. The pay scale is subject to change depending on business needs. Your recruiter can share more about the specific salary range for your preferred location during the hiring process. Additional compensation may include benefits discretionary bonuses and equity.

As a world leader in the semiconductor industry Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well provide peace of mind and help you prepare for the future. We offer a choice of medical dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury and paid family leave. Additionally Micron benefits include a robust paid timeoff program and paid holidays. For additional information regarding the Benefit programs available please see the Benefits Guide posted on micron/careers/benefits.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race color religion sex sexual orientation age national origin citizenship status disability protected veteran status gender identity or any other factor protected by applicable federal state or local laws.

To learn about your right to work click here.

To learn more about Micron please visit micron/careers

US Sites Only: To request assistance with the application process and/or for reasonable accommodations please contact Microns People Organization at or(select option #3

Micron Prohibits the use of child labor and complies with all applicable laws rules regulations and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.