Senior Principal Design Engineer

Your position will be in the design group and you will be working in projects with a complete team responsible for system engineering, design, characterization, test and qualification of products, EDA support and industrialization of high-volume products. You will be located in Nijmegen R&D center. Other R&D centers are in Penang, Shanghai and Dallas.

Tasks

What you will do

• Partner with internal and external customers on requirements and product solutions
• Develop new and differentiating architectures, perform feasibility studies, compare competitor solutions and define IP roadmap
• Contribute to the business group roadmap by proposing and selecting IC processes and packages, optimal for product portfolio, costs and customer acceptance
• Translate product requirements into IC solutions while trading off performance, area and cost
• Define and document architecture with specifying functional and parametrical block-requirements including design for test solutions
• Work daily in local multi-functional teams of package architects, design engineers, device physicist, test and product engineers, product manager and project leader
• Communicate with foundry and subcon engineering support groups to achieve technical insights in IC process and package technology capability and methods for product introductions
• Act as an accountable technical lead in complex projects, schedule and take ownership of tasks, manage design team and update daily report of progress to team and project leaders
• Perform actual design, optimization and simulations of IC blocks and top-level circuits using Synopsys/Cadence tools and target First Time Right designs
• Perform full statistical verification of datasheet parameters
• Guide and steer floor-planning, layout of (sub)blocks and top-level layout and wiring diagram creation
• Carrying out IP bench validation and support product and test engineering with the validation of datasheet parameters
• Perform design reviews, evaluations, characterization and test results
• Create and archive project documents, technical documents and databases
• Proactively share knowledge and best practices with your design team
• Contribute to improve way of working in the R&D group

Requirements

What you will need

• Masters degree or PhD in Electrical & Electronic Engineering
• 10+ years experience in RF Analog Circuit Design and related design flows
• Skilled with Synopsys or Cadence schematic design, simulator, layout and verification tooling
• Experienced with signal ICs, preferably in the area of analog and digital signal processing and voltage translation, USB, MIPI, DisplayPort, HDMI interfaces, bridges, re-drivers and switches products. Products typically operate in the area of 1.2V up-to 5V.
• Full competence with all aspects of Analog design and affinity with digital designs
• Experienced in 0.18um to 0.11um CMOS and BCD processes of the Semiconductor industry
• Experience in Plastic Package and Wafer Level Package technologies
• Own knowledge and experience with Electrostatic Discharge and Latch-Up mechanisms and application of ESD protection strategies and devices
• A thorough understanding of Semiconductor Physics and Device operation
• Possesses Analytical Skills and ability to apply pragmatic approaches
• Feeling for industrialization and reporting
• Good communication skills in English, both written and spoken
• Strong Team player with strong human relation, motivational and challenging skills
• Target driven, shows initiative, own an entrepreneurial attitude and work independently
• Experience as Technical Lead and RF Analog design

Benefits

Company has extensive benefits packages including:

Holiday allowance (8%) and performance bonus (5-10%)

25 holiday days. Can purchase 20 extra leave days per year

Pension plan

Healthcare insurance:

Commuting to work allowance (max 145.60 per month)

We offer

An environment where we share knowledge and learn from each other every day, your input and feedback are valued. This means in addition to architectural design and hands-on design; you will be contributing to improving the way of working in the R&D group. You will be part of the technology team where your ideas can influence IC designs, development and future package and wafer technologies. Plus, you will contribute to the business group roadmap by proposing and selecting IC processes and packages, optimal for product portfolio, costs and customer acceptance.