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Intrinsic Reliability Lead Head – Semiconductor Device Reliability

Best NanoTech


Job Location:

Dholera - India

Monthly Salary: Not provided by the employer
Posted: 9 June 2026 (30+ days ago)
Application Deadline: 6 September 2026
Vacancies: 1 Vacancy

Job Summary

Intrinsic Reliability Lead / Head Semiconductor Device Reliability
  • Location: Dholera / Ahmedabad Gujarat India
  • Work Mode: Onsite
  • Experience: 15 Years
Role Overview

Lead the development of semiconductor intrinsic and product reliability capability for a new semiconductor manufacturing organization. Responsible for establishing reliability laboratories defining reliability methodologies driving qualification programs and building high-performing reliability teams. This role requires deep expertise in semiconductor device failure mechanisms accelerated testing reliability modelling and technology qualification.

Key Responsibilities
  • Define intrinsic and product-level reliability requirements.
  • Establish and operationalize reliability laboratories and testing infrastructure.
  • Procure and qualify reliability test and monitoring equipment.
  • Develop standardized reliability test procedures and methodologies.
  • Support R&D and technology transfer programs through reliability analysis.
  • Lead intrinsic and product reliability qualification strategies.
  • Develop reliability models for device aging and degradation.
  • Analyze semiconductor failure mechanisms and qualification data.
  • Build and lead global cross-functional reliability teams.
  • Drive customer confidence through reliability assurance programs.
  • Present reliability results to executive leadership and customers.
  • Support new technology introduction and manufacturing qualification.
Required Qualifications
  • M.S. or PhD in Physics Electrical Engineering Materials Science or related discipline.
  • 15 years of semiconductor industry experience.
  • Proven experience establishing advanced semiconductor reliability laboratories.
  • Strong background in intrinsic device reliability and product reliability.
Technical Skills Device Reliability
  • Intrinsic Reliability
  • Product Reliability
  • Device Reliability
  • Reliability Qualification
Failure Mechanisms
  • Hot Carrier Injection (HCI)
  • Time Dependent Dielectric Breakdown (TDDB)
  • Negative Bias Temperature Instability (NBTI)
  • Electromigration (EM)
  • Stress Migration (SM)
Accelerated Testing
  • HTOL
  • HTRB
  • HTGB
  • Accelerated Reliability Testing
  • Reliability Monitoring
Reliability Modeling
  • Aging Models
  • Lifetime Prediction
  • Reliability Statistics
  • Design of Experiments (DOE)
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