Thermal Mechanical Engineer

PsiQuantumsmission is to build the first useful quantum computersmachines capable of delivering the breakthroughs the field has long promised. Since our founding in 2016 our singular focus has been to build and deploy million-qubit fault-tolerant quantum systems.

Quantum computers harness the laws of quantum mechanics to solve problems that even the most advanced supercomputers or AI systems will never reach. Their impact will span energy pharmaceuticals finance agriculture transportation materials and other foundational industries.

Our architecture and approachisbased on silicon photonics. Byleveragingthe advanced semiconductor manufacturing industryincluding partners like GlobalFoundrieswe use the same high-volume processes that already produce billions of chips for telecom and consumer electronics. Photonics offers natural advantages for scale: photonsdontfeel heat are immune to electromagnetic interference and integrate with existing cryogenic cooling and standard fiber-optic infrastructure.

In 2024PsiQuantumannounced government-funded projects to support the build-out of our first utility-scale quantum computers in Brisbane Australia and Chicago Illinois. These initiatives reflect a growing recognition that quantum computing will be strategically and economically definingand that now is the time to scale.

PsiQuantumalso develops the algorithms and software needed to make these systems commercially valuable. Our application software and industry teams work directly with leading Fortune 500 companiesincluding Lockheed Martin Mercedes-Benz Boehringer Ingelheim and Mitsubishi Chemicalto prepare quantum solutions for real-world impact.

Quantum computing is not an extension of classical computing. Itrepresentsa fundamental shiftand a path to mastering challenges that cannot besolvedany other way. The potential is enormous and we have a clearpathto make it real.

Come join us.

Job Summary:

The system engineering department is hiring a thermal mechanical engineer. You will be responsible for performing structural and thermal simulations to optimize the design of electro-optical sub-assemblies. Your work will directly impact on the performance and reliability of our quantum computer sub-systems.

Responsibilities:

• Develop detailed FEA/CFD models of components packages optical-electronic modules and system-level assemblies using appropriate simulation tools such as ANSYS COMSOL or equivalent platforms.
• Correlate FEA results with experimental measurements prototype test data and hardware observations to improve model fidelity and support simulation-driven design decisions.
• Perform warpage and deformation analysis for multimaterial assemblies accounting for mismatch in thermal expansions nonlinear material behavior temperature gradients and boundary conditions.
• Develop thermal cycling and mechanical fatigue models to predict longterm reliability including creep stress relaxation and interface degradation.
• Identify mechanical risk drivers and recommend design material or process changes to improve robustness manufacturability and yield.
• Analyze failures related to electro-optical assembly design and providing solutions. General design activities such as requirements management materials and component selection Design Failure Modes and Effects Analysis (FMEA) and tolerance analyses.
• Develop end-to-end simulation workflows to automate processes assess performance across diverse operating scenarios documentation and tools to improve efficiency accuracy and repeatability.
• Document and communicate results through clear technical reports design reviews and executive level summaries.

Experience/Qualifications:

• . or Ph.D in Mechanical Engineering Electrical Engineering and Physics or related field.
• 5years of hands-on modeling and simulation experience in the semiconductor industry.
• Strong understanding of thermal conduction and convective heat transfer methodologies.
• Deep knowledge of solid mechanics principles including stress strain fatigue creep constitutive models of elastic visco-plastic and plastic materials.
• Proficiency with simulation tools such as ANSYS (Mechanical Icepak and Fluent) COMSOL or equivalent including nonlinear and transient analyses.
• Working knowledge of lab-scale validation techniques.

Desired Skills/Experience:

• Experience with Ansys AEDT and Ansys Sherlock.
• Understanding advanced semiconductor packaging solder joints and reliability modeling techniques.
• Knowledge of common optical system specifications and optical component specifications.
• Exposure to SOC thermal mechanical analysis.
• Exposure to optical structural analysis.

PsiQuantum provides equal employment opportunity for all applicants and employees. PsiQuantum does not unlawfully discriminate on the basis of race color religion sex (including pregnancy childbirth or related medical conditions) gender identity gender expression national origin ancestry citizenship age physical or mental disability military or veteran status marital status domestic partner status sexual orientation genetic information or any other basis protected by applicable laws.

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