Join a team shaping the future of high-speed semiconductor and system design

Our client is seeking an experienced Principal Hardware Design Engineer to join a world-class Central Engineering organization focused on next-generation high-speed systems and PCB design. This is an exciting opportunity to work at the forefront of advanced semiconductor technologies supporting industries including networking automotive storage and security.

In this highly visible role youll contribute to the design and validation of cutting-edge reference platforms and high-speed systems operating at industry-leading speeds. Youll collaborate with signal integrity package design silicon and systems teams to develop complex PCIe Gen5/Gen6 platforms and enterprise reference systems that push technological boundaries.

If you enjoy solving challenging hardware design problems working with advanced SI/PI tools and contributing to innovative products used globally this role offers exceptional technical depth and career growth.

Why Youll Love This Opportunity

• Work on industry-leading PCIe Gen5/Gen6 and high-speed SERDES technologies
  
• Be part of a highly respected central engineering organization influencing multiple business units
  
• Collaborate with top-tier silicon package SI and systems engineers
  
• Design complex validation and reference platforms used across global products
  
• Exposure to advanced signal integrity and power integrity technologies
  
• Opportunity to work directly with customers and industry partners
  

What Youll Do

• Design and develop high-speed PCIe Gen5/Gen6 reference boards and enterprise systems
  
• Define signal integrity (SI) requirements and implementation guidelines for internal and external design teams
  
• Perform SI and PI simulations to ensure optimal board and package performance
  
• Design and implement low-voltage high-current multiphase power solutions
  
• Develop schematics and work closely with PCB layout teams throughout implementation
  
• Collaborate with RTL package characterization and validation teams
  
• Support board bring-up debugging and system validation activities
  
• Select components connectors cables and clock distribution architectures
  
• Interface with external vendors and customers to support implementation and troubleshooting efforts
  
• Drive technical decisions related to board architecture and system design
  

Requirements

• Bachelors degree in Electrical Engineering Computer Engineering or related field with 510 years of experience
  
  OR
  
• Masters/PhD with 35 years of relevant experience
  
• Experience leading Signal Integrity engineering initiatives
  
• Strong expertise in:
  • High-speed differential pair design
    
  • PCIe Gen4/Gen5/Gen6 technologies
    
  • High-speed PCB design and validation
    
  • Signal Integrity and Power Integrity analysis
    
  • Reference board development for chip validation
    
• Deep understanding of:
  • Transmission lines
    
  • Via structures
    
  • High-speed connectors
    
  • Complex BGA package modeling
    
• Proficiency with SI/PI and EM tools such as:
  • Sigrity
    
  • SI Soft
    
  • HFSS
    
  • HSPICE
    
• Experience with 25Gbps SERDES analysis
  
• Familiarity with:
  • Real-time oscilloscopes
    
  • TDR
    
  • VBA
    
• Experience with schematic capture and PCB layout tools (Cadence preferred)
  
• Strong communication and customer-facing skills
  

Preferred Qualifications

• Experience with ADS QSI/QDC or HyperLynx
  
• Experience performing Power Integrity simulations
  
• Familiarity with cloud compute systems and enterprise server architectures
  
• Experience with PCIe CEM sockets and EDSFF systems
  
• Mechanical design awareness related to board implementation
  
• Experience collaborating with package characterization and validation teams
  

Ideal Candidate

The ideal candidate is a technically strong hardware engineer with deep expertise in high-speed systems signal integrity and advanced PCB design. You thrive in collaborative environments enjoy solving complex engineering challenges and are excited by the opportunity to influence next-generation semiconductor platforms.