Packaging Process Engineer – Microdisplay

Snap


Job Location:

Chandler, TX - USA

Yearly Salary: $ 135000 - 203000
Posted on: Yesterday
Vacancies: 1 Vacancy

Job Summary

Snap Inc is a technology company. We believe the camera presents the greatest opportunity to improve the way people live and communicate. Snap contributes to human progress by empowering people to express themselves live in the moment learn about the world and have fun together. The Companys three core products are Snapchat a visual messaging app that enhances your relationships with friends family and the world; Lens Studio an augmented reality platform that powers AR across Snapchat and other services; and its AR glasses Spectacles.

Snaps camera supports real friendships through visual communication self expression and storytelling. Moving forward our camera will play a transformative role in how people experience the world around them combining what they see in the real world with all thats available to them in the digital world.

Were looking for a Packaging Process Engineer to join our team at Snap Inc!

What Youll Do:

This role will serve as the technical process owner for backend packaging and continuity testing tool supporting our advanced displays from prototyping through production. As an engineer you would drive process development yield and manufacturability on our microdisplay production line.

Additionally you will:

  • Own and optimize a backend packaging process for LCOS advanced displays from early development through high-volume manufacturing ensuring stable high-yield output.

  • Act as the primary technical interface for equipment materials and manufacturing partners overseeing tool qualification process capability build readiness and issue resolution.

  • Develop qualify and sustain assembly and packaging recipes control plans and SPC systems driving continuous improvement in CD/overlay defectivity yields and reliability.

  • Lead structured problem solving (DOEs FMEA root cause analysis corrective actions) for yield excursions line stops and parametric drifts.

  • Partner with cross-functional teams to define capacity models and WIP/uptime strategies.

Knowledge Skills & Abilities:

  • Hands-on experience with automated packaging equipment including recipe setup tuning and troubleshooting.

  • Proven ability to function as a module owner in a high-volume fab or OSAT environment balancing NPI design transfer activities and roadmap work.

  • Exceptional problem solver with a structured solution focused approach leveraging advanced statistical tools to improve yield and stability in packaging.

  • Comfortable working in an ISO 5 cleanroom environment and enforcing best practices in contamination control safety and EHS compliance.

Minimum Qualifications:

  • BS degree in Electrical Engineering Materials Science Mechanical Engineering or a related technical field

  • 7 years of experience as a process or packaging engineer in microfabrication fabs.

  • Direct experience designing and optimizing automated production equipment for semiconductors or displays

  • Direct experience in final test for semiconductor or display packages.

  • Demonstrated track record of improving yield and process stability through structured experimentation (DOE) SPC and cross-functional problem solving.

  • Experience planning and executing process transfers from R&D to production lines.

  • International travel between Taiwan U.S. and supplier sites (up to 10%).

Preferred Qualifications:

  • 10 years of experience in process engineering and backend packaging.

  • Ownership of module performance and direct collaboration with applications engineers.

  • Excellent problem solver with a foundation in Six Sigma.

  • Experience with automated optical assembly and test equipment.

  • Experience developing and sustaining wire bonding processes (materials bond parameters loop profiles pad design interfaces) for highdensity LOCS packages.

  • Strong expertise in backend assembly processes for advanced displays including die attach marking and final packing.

If you have a disability or special need that requires accommodation please dont be shy and provide us some information.

Default Together Policy at Snap: At Snap Inc. we believe that being together in person helps us build our culture faster reinforce our values and serve our community customers and partners better through dynamic collaboration. To reflect this we practice a default together approach and expect our team members to work in an office 4 days per week.

At Snap we believe that having a team of diverse backgrounds and voices working together will enable us to create innovative products that improve the way people live and communicate. Snap is proud to be an equal opportunity employer and committed to providing employment opportunities regardless of race religious creed color national origin ancestry physical disability mental disability medical condition genetic information marital status sex gender gender identity gender expression pregnancy childbirth and breastfeeding age sexual orientation military or veteran status or any other protected classification in accordance with applicable federal state and local laws. EOE including disability/vets.

We are an Equal Opportunity Employer and will consider qualified applicants with criminal histories in a manner consistent with applicable law (by example the requirements of the San Francisco Fair Chance Ordinance and the Los Angeles Fair Chance Initiative for Hiring where applicable).

Our Benefits: Snap Inc. is its own community so weve got your back! We do our best to make sure you and your loved ones have everything you need to be happy and healthy on your own terms. Our benefits are built around your needs and include paid parental leave comprehensive medical coverage emotional and mental health support programs and compensation packages that let you share in Snaps long-term success!

Compensation

In the United States work locations are assigned a pay zone which determines the salary range for the position. The successful candidates starting pay will be determined based on job-related skills experience qualifications work location and market conditions. The starting pay may be negotiable within the salary range for the position. These pay zones may be modified in the future.

Zone A (CA WA NYC):

The base salary range for this position is $142000-$214000 annually.


Zone B:

The base salary range for this position is $135000-$203000 annually.

Zone C:

The base salary range for this position is $121000-$182000 annually.

This position is eligible for equity in the form of RSUs.

Required Experience:

IC

Snap Inc is a technology company. We believe the camera presents the greatest opportunity to improve the way people live and communicate. Snap contributes to human progress by empowering people to express themselves live in the moment learn about the world and have fun together. The Companys three c...

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We believe the camera presents the greatest opportunity to improve the way people live and communicate.

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