Memory Packaging Engineer

Join the team at the heart of memory innovation for every Apple product. As a Memory Packaging Engineer you will architect the memory solutions that power the industry-leading performance of Apples hardware. We push the boundaries of bandwidth density power efficiency and system integration through meticulous co-design between memory technology and our world-class systems. If you are driven to solve the industrys toughest packaging challenges your work will have a profound and lasting impact on the products used by millions.

In this role you will drive the definition development and qualification of next-generation memory packages critical to Apples future will guide the package roadmaps of our memory partners and collaborate with internal engineering teams to enable bandwidth and density ownership will span the entire product lifecycle from initial concept through qualification.

Determine the direction of next-generation package architecture by evaluating available and emerging packaging with cross-functional teams to solve integration challenges including electrical mechanical and vendor DOEs and failure analysis to improve downstream yield and maintain world-class quality and the memory package POR (plan of record): Package form factor process layout stackup and bill of materials (BOM).nDrive memory vendors to develop package materials and technology for leading-edge package design rules.

BS and 10 years of relevant industry experience

MS or PhD preferred with 10 years of industry experience in package design and assembly process development of high-bandwidth and high-density memory knowledge of thin-die stacking technologies including wirebond flip-chip and wafer/die knowledge of packaging materials and design to engineer warpage and CTE properties and mitigate thermal working experience in package test and reliability system-level downstream process interaction and packaging inspection understanding of SI/PI co-design with memory die and high-speed DDR or differential of how memory die floorplan and architecture influence package structure and routing with experience collaborating with memory die design communication skills for collaborating with internal teams and managing external vendors.