Defect Engineer
Fort Collins, CO - USA
Job Summary
Please Note:
1. If you are a first time user please create your candidatelogin account before you apply for a job. (Click Sign In > Create Account)
2. If you already have a Candidate Account please Sign-In before you apply.
Job Description:
Job Overview
As a Defect Engineer within the Wireless Semiconductor Division (WSD) at Broadcom Inc. you will play a critical role in identifying analyzing and minimizing defectivity within our FBAR filter fabrication process. Utilizing inline visual inspection and physical analysis data you will separate killer from cosmetic defects map out defect Paretos and provide actionable insights to the cross-functional fab team.
Your work directly minimizes yield loss and reliability failures downstream at wafer sort assembly test and the end this role you will collaborate with product development and backend assembly to characterize defects define line partitioning and sampling strategies and own the FBAR visual control plan.
Key Responsibilities
Defect Detection & Root Cause Analysis
Establish Technology Baselines: Utilize advanced metrology and physical analysis data (SEM TEM AFM FIB) to define baseline defectivity and establish Paretos for new and existing technologies.
Identify Source Failures: Pinpoint offending tools processes or facility infrastructure driving defect excursions.
Excursion Containment: Initiate corrective actions (PDCA 8D) place underperforming tools down and issue material containment for non-conforming or out-of-control (OOC) material.
Lab Characterization: Partner with the Physical Analysis Lab (PAL) and bench testing teams to submit jobs and successfully characterize unique defect signatures.
Process Improvement: Partner with integration and process engineers to improve defect performance and identify new defects on emerging process nodes.
Controls Strategy & Line Monitoring
Own the Visual Control Plan: Define line partitioning monitoring and sampling strategies using Klarity and Statistical Process Control (SPC) to maintain stringent fab defect controls.
Author OCAPs: Write and maintain Out-of-Control Action Plans (OCAPs) to establish standard operational responses to defect shifts.
Material Disposition: Act as the primary engineering escalation point to disposition OOC material that falls beyond the scope of engineering technicians. Identify and characterize novel defect modes through detect contain eliminate procedure.
Team Leadership & Culture
Lead Task Forces: Facilitate and lead cross-functional engineering teams investigating complex trend shifts and high-volume defectivity issues. Lead model building activities to hypothesize and validate root causes of defectivity.
Train and Mentor: Train operations staff on material disposition and mentor engineering technicians in advanced defect identification and characterization techniques.
Quality First Mindset: Actively drive a low-defect quality before speed and cost culture across the entire fab footprint.
Required Skills & Qualifications
Education: BS in Electrical Engineering Materials Science Physics Chemistry or a related engineering field.
Experience: 8 years of experience in high-volume wafer fabrication specifically within process engineering defect engineering or yield enhancement.
Technical Expertise:
Strong working knowledge of multiple semiconductor fabrication process modules (e.g. photo etch deposition CMP test).
Direct expertise with Klarity defect analysis software and Statistical Process Control (SPC).
Advanced proficiency using JMP for statistical data analysis and engineering problem-solving.
Leadership & Drive: Proven track record of independently facilitating cross-functional teams to resolve highly complex manufacturing problems.
Communication: Demonstrated ability to communicate technical data clearly and concisely both verbally and in writing to audiences ranging from cleanroom operators to fab executives.
Soft Skills: Detail-oriented multitasker with strong self-awarenessknows when and who to ask for cross-functional help.
Preferred Skills & Qualifications
Education: MS or PhD in Electrical Engineering Materials Science Physics Chemistry or a related field.
Experience: 12 years of experience in high-volume semiconductor manufacturing.
Advanced Material Analytics: Direct hands-on tracking and root-cause identification using physical analysis lab (PAL) tool outputs (SEM TEM AFM FIB).
Data Automation & Programming:
Proficiency in programming languages (e.g. Python SQL) to query large defect databases automate reporting and execute trend analysis.
Experience with Python data structures (Pandas/NumPy) spatial math geometric logic and parsing raw file formats (such as .klarf files).
Data Visualization: Experience developing automated Spotfire data links and interactive dashboards optimized for a production wafer manufacturing environment.
Advanced Automation & AI: Practical experience with defect data automation automatic defect detection/classification (ADC) software or implementing AI models for wafer map pattern recognition.
Other Requirements
Strict adherence to cleanroom protocols contamination controls and fab safety standards.
Additional Job Description:
Compensation and Benefits
The annual base salary range for this position is $109700 - $175500.
This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents and equity in accordance with equity plan documents and equity award agreements.
Broadcom offers a competitive and comprehensive benefits package: Medical dental and vision plans 401(K) participation including company matching Employee Stock Purchase Program (ESPP) Employee Assistance Program (EAP) company paid holidays paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence.
Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race color creed religion sex sexual orientation national origin citizenship disability status medical condition pregnancy protected veteran status or any other characteristic protected by federal state or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.
If you are located outside USA please be sure to fill out a home address as this will be used for future correspondence.
Required Experience:
IC
About Company
Broadcom Inc. is a global technology leader that designs, develops and supplies a broad range of semiconductor, enterprise software and security solutions.