Our client is a Silicon Valley-based hardware startup pioneering infrastructure solutions that accelerate AI data centers delivering Faster AI. Todays AI performance is frequently limited by communication bottlenecks.
Our client introduces multiple industry-first innovations across silicon packaging software and systems to deliver an order-of-magnitude improvement in performance and unlock greater GPU utilization speeding training job completion times and tokens-per-second for more profitable inference.
Our client has raised over $200M to date including its most recent oversubscribed Series A round. The company is led by a veteran team of Silicon Valley executives who have delivered multiple billion dollar product lines and led multiple companies to billion dollar exits.
The company is in execution mode and has a world-class engineering team with decades of experience in state-of-the-art silicon packaging optics software and systems. Our client is working with best-in-class supply chain partners including silicon packaging and systems.
Position Overview
We are hiring multiple positions from Sr. Engineer to Principal Engineer.
We are looking for a highly experienced Post-Silicon ASIC Validation Engineer with deep expertise in networking ASICs and chiplet-based architectures. You will lead bring-up validation and characterization of complex multi-die systems integrating high-speed interconnects such as UCIe SerDes PCIe and Ethernet PHYs. This position offers the opportunity to work on next-generation networking SoCs and disaggregated chiplet platforms collaborating across architecture design firmware and system teams to ensure first-silicon success and robust product readiness.
Responsibilities
Drive post-silicon validation and bring-up of networking ASICs and chiplet-based SoCs.
Own validation planning coverage definition and test execution across UCIe SerDes and networking subsystems.
Develop automation and test infrastructure for high-speed link and protocol validation (Python).
Perform silicon bring-up including power sequencing link training and PHY initialization.
Execute link-level and system-level validation of UCIe interfaces die-to-die interconnects and high-bandwidth chiplet fabrics.
Debug complex cross-domain issues spanning RTL firmware analog PHY and package-level interactions.
Characterize signal integrity latency throughput and thermal/power behavior across PVT corners.
Collaborate with board design and test engineering teams on validation platforms sockets and characterization boards.
Qualifications
B.S. or M.S. in Electrical Engineering Computer Engineering or related field.
Experience in post-silicon validation and bring-up of complex ASICs or SoCs.
Hands-on experience with UCIe PCIe and high-speed interconnect standards.
Proficiency in Python for scripting automation and data analysis.
Strong lab experience using oscilloscopes BERTs logic analyzers and JTAG-based debuggers.
Excellent communication skills and experience working in cross-functional silicon development teams.
Preferred Qualifications
Experience with chiplet-based systems UCIe protocol stack validation and multi-die integration challenges (power delivery timing thermal).
Familiarity with emulation or FPGA prototyping platforms for pre-silicon validation.
Exposure to hardware/software co-validation for networking protocols or control-plane software.
Strong knowledge of package-level interactions and signal integrity analysis for high-speed interfaces.
Job Description: Our client is a Silicon Valley-based hardware startup pioneering infrastructure solutions that accelerate AI data centers delivering Faster AI. Todays AI performance is frequently limited by communication bottlenecks. Our client introduces multiple industry-first innovations across...
Job Description:
Our client is a Silicon Valley-based hardware startup pioneering infrastructure solutions that accelerate AI data centers delivering Faster AI. Todays AI performance is frequently limited by communication bottlenecks.
Our client introduces multiple industry-first innovations across silicon packaging software and systems to deliver an order-of-magnitude improvement in performance and unlock greater GPU utilization speeding training job completion times and tokens-per-second for more profitable inference.
Our client has raised over $200M to date including its most recent oversubscribed Series A round. The company is led by a veteran team of Silicon Valley executives who have delivered multiple billion dollar product lines and led multiple companies to billion dollar exits.
The company is in execution mode and has a world-class engineering team with decades of experience in state-of-the-art silicon packaging optics software and systems. Our client is working with best-in-class supply chain partners including silicon packaging and systems.
Position Overview
We are hiring multiple positions from Sr. Engineer to Principal Engineer.
We are looking for a highly experienced Post-Silicon ASIC Validation Engineer with deep expertise in networking ASICs and chiplet-based architectures. You will lead bring-up validation and characterization of complex multi-die systems integrating high-speed interconnects such as UCIe SerDes PCIe and Ethernet PHYs. This position offers the opportunity to work on next-generation networking SoCs and disaggregated chiplet platforms collaborating across architecture design firmware and system teams to ensure first-silicon success and robust product readiness.
Responsibilities
Drive post-silicon validation and bring-up of networking ASICs and chiplet-based SoCs.
Own validation planning coverage definition and test execution across UCIe SerDes and networking subsystems.
Develop automation and test infrastructure for high-speed link and protocol validation (Python).
Perform silicon bring-up including power sequencing link training and PHY initialization.
Execute link-level and system-level validation of UCIe interfaces die-to-die interconnects and high-bandwidth chiplet fabrics.
Debug complex cross-domain issues spanning RTL firmware analog PHY and package-level interactions.
Characterize signal integrity latency throughput and thermal/power behavior across PVT corners.
Collaborate with board design and test engineering teams on validation platforms sockets and characterization boards.
Qualifications
B.S. or M.S. in Electrical Engineering Computer Engineering or related field.
Experience in post-silicon validation and bring-up of complex ASICs or SoCs.
Hands-on experience with UCIe PCIe and high-speed interconnect standards.
Proficiency in Python for scripting automation and data analysis.
Strong lab experience using oscilloscopes BERTs logic analyzers and JTAG-based debuggers.
Excellent communication skills and experience working in cross-functional silicon development teams.
Preferred Qualifications
Experience with chiplet-based systems UCIe protocol stack validation and multi-die integration challenges (power delivery timing thermal).
Familiarity with emulation or FPGA prototyping platforms for pre-silicon validation.
Exposure to hardware/software co-validation for networking protocols or control-plane software.
Strong knowledge of package-level interactions and signal integrity analysis for high-speed interfaces.