SiP Process Engineer

SiP Process Engineer

Position Summary

We are seeking an experienced SiP (System-in-Package) Process Engineer to develop qualify transfer and optimize assembly processes from prototype through high-volume manufacturing. The role focuses on product quality yield improvement and resolving manufacturing issues in collaboration with Design Package Engineering Equipment Quality Reliability and Manufacturing teams.

Key Responsibilities

• Develop and optimize SiP assembly processes for multi-die and heterogeneous integration products.
• Establish process flows parameters specifications and control plans.
• Support die attach flip chip wire bonding SMT and component placement underfill molding singulation laser marking shielding and rework processes.
• Lead engineering builds design of experiments (DOE) process characterization and qualification.
• Review package and product designs for manufacturability and assembly feasibility (DFM/DFA).
• Support new product introduction and transfer from R&D or pilot production to mass manufacturing.
• Analyze process and yield data identify root causes of defects and implement corrective actions.
• Evaluate new materials equipment and process technologies for SiP applications.

Required Qualifications

• Bachelors or Masters degree in Electrical Mechanical Materials Electronics or Chemical Engineering or a related field.
• Typically 38 years of semiconductor packaging assembly or SiP process engineering experience depending on level.
• Hands-on experience with semiconductor packaging and assembly processes.
• Understanding of manufacturing process control.
• Experience with DOE SPC FMEA 8D root-cause analysis and statistical analysis.
• Ability to connect process parameters with product performance.
• Strong technical problem-solving and communication skills.

Preferred Experience

Experience in one or more of the following: SiP multi-chip modules heterogeneous integration chiplet packaging 2.5D/3D packaging flip chip wire bonding die attach SMT fan-out packaging package-on-package embedded die technologies RF SiP automotive SiP MEMS packaging or advanced IC packaging.