Principal Engineer, FE OCT CPEE ADT BOND

Our vision is to transform how the world uses information to enrich life for all.

Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity sustainability and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.

As a Bonding Process & Equipment Engineer at Micron Technology you will be part of Micron Central team under ADT responsible for the startup development optimization and control of wafer leve bonding processes (e.g. hybrid bonding fusion bonding temporary bonding).

You will drive yield improvement cost reduction process capability enhancement and risk management while resolving complex manufacturing challenges. This role requires collaboration across process integration equipment engineering suppliers and global manufacturing sites.

• Develop qualify and optimize bonding process technologies (e.g. hybrid bonding dielectric bonding TSV-related integration)

• Establish refine and simplify process conditions recipes and operating windows to meet performance and reliability targets

• Drive process capability improvement (Cpk) and defect reduction

• Lead yield enhancement initiatives by analyzing process tool and material interactions

• Perform systematic root cause analysis using methodologies such as DOE FMEA 8D SPC and fault isolation techniques

• Evaluate defect modes (voids misalignment delamination corrosion) and implement corrective actions

• Collaborate with equipment engineering to qualify and optimize bonding grinding and trimming tools (e.g. EVG TEL Disco platforms)

• Define equipment specifications roadmap process control strategies and matching/fingerprinting requirements

• Evaluate and introduce new materials/spares/parts for performance improvement

• Support technology transfer and ramp-up across global sites

• Align process baseline (POR) and ensure consistency through documentation and control plans

• Work closely with integration CMP WET and Films teams to ensure cross-module compatibility

• Diagnose and resolve manufacturing line issues impacting bonding yield and performance

• Analyze process excursions and implement containment and recovery actions

• Drive continuous improvement for cycle time tool availability and cost efficiency

• Lead new process and baseline qualifications

• Develop control plans SPC strategies and inline monitoring systems

• Establish risk mitigation frameworks and ensure compliance with manufacturing standards

• Partner with suppliers for technology development process improvement and cost optimization

• Audit material and equipment suppliers to ensure quality and reliability targets are met

• Collaborate with global teams and partners to drive alignment and execution

About Micron Technology Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich lifefor all. With a relentless focus on our customers technology leadership and manufacturing and operational excellence Micron delivers a rich portfolio of high-performance DRAM NAND and NOR memory and storage products through our Micron and Crucial brands. Every day the innovations that our people create fuel the data economy enabling advances in artificial intelligence and 5G applications that unleash opportunities from the data center to the intelligent edge and across the client and mobile user experience.

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