External Package Innovation Engineer
Kuala Lumpur - Malaysia
Job Summary
Hiring: External Package Innovation Engineer
We are looking for a highly motivated engineer to drive external package innovation initiatives and collaborate closely with OSAT partners for successful project execution.
Role Overview
As anEPI engineer you will act as both aRole OwnerandKey Supporterfor OSAT-related development activities ensuring robust execution from concept through production.
Key Responsibilities
1. Role Owner (Strategic & Governance)
- Own and leadOSAT-wide and cross-OSAT initiatives
- Define and deploystandard development templates and success criteriaacross OSATs
- Drive deployment ofBest Known Methods (BKM)and lessons learned
- Develop and maintaintechnology roadmap and capability assessmentfor each OSAT site
- ProvidePackage Innovation (PI) inputfor:
- External site sourcing strategy
- Site selection process (jointly with interface manager)
- Leadproject governance including:
- Overall project summaries
- Stoplight reporting
- Regular reviews per OSAT site
2. Supporter (Execution & Project Delivery)
- SupportNPI & NTI projectsexecuted at external OSAT factories
- Ensure OSAT compliance with:
- Development processes
- Required documentation/templates
- Drive alignment onSME (Subject Matter Expert) assignmentat OSAT
- Support and resolvetechnical and project issueson-site and across time zones
- Ensureassembly readiness and safe production launch
Stakeholder Collaboration
You will work closely with cross-functional teams including:
- Project Leaders & Development Managers
- Designers & Materials Engineers
- Tech Integration & Modelling teams (Electrical Mechanical Thermal)
- API and WLP/PLP/FC SMEs
- OSAT partners
What Were Looking For
- Strong experience insemiconductor packaging (especially with handson assembly process experience such as pre-assembly and wire bonding). Previous exposure to OSAT ecosystem is an added advantage.
- Proven ability to managecross-site cross-functional projects
- Solid understanding ofNPI/NTI development flows
- Excellentstakeholder management and communication skills
- Ability to drivestandardization governance and technical problem-solving
Why Join Us
- Opportunity to leadhigh-impact package innovation initiatives
- Work withglobal teams and OSAT partners for wide exposure and fast knowledge & skill growth
- Drivetechnology roadmap and next-generation packaging solutions
Required Experience:
IC
About Company
NXP is a global semiconductor company creating solutions that enable secure connections for a smarter world.