Electro Mechanical Engineer

Key Responsibilities
Design 300 mm wafer chucks including vacuum chucks edge grip mechanisms compliant fingers and kinematic supports.
Perform stress deformation and warp accommodation modeling to ensure ultra low wafer stress during handling.
Develop motion mechanisms for raise/lower (Z axis) and edge grip actuation that prevent wafer damage and meet precision requirements.
Ensure all designs meet ISO Class 1 cleanroom particle generation specifications and support high volume 24/7 fab operation.
Select appropriate low outgassing non particulating materials (e.g. PEEK Vespel Alumina DLC etc.) and coatings suitable for semiconductor tools.
Work with controls engineers on soft landing jerk limited motion profiles and closed loop sensing for wafer presence alignment and force control.
Conduct FEA simulations for thin wafer stress contact mechanics modal behavior and static/dynamic loads.
Perform particle testing vacuum leak testing wafer stress validation and endurance testing.
Generate engineering documentation: DFMEA test plans tolerance stackups and SEMI/ISO compliance documents.
Collaborate with cross functional teams (systems electronics materials manufacturing) for prototype builds and tool integration.

Skill Requirements

Technical Skills
300 mm wafer handling design (edge grip vacuum kinematic support)
Precision chuck design & compliant mechanisms
FEA (ANSYS Abaqus COMSOL) - stress modal and contact analysis
Modeling warped/bowed wafers thin plate mechanics
Cleanroom design principles - ISO Class 1 low particle mechanisms
Vacuum system design leak tight sealing He leak testing

Material selection for semiconductor tools:
PEEK Vespel PTFE PPS
Alumina Aluminum Nitride Ti 6Al 4V
Hard anodize DLC TiN Parylene coatings

Motion system design:
Linear motors voice coil actuators pneumatic micro actuators
Flexures guides cross roller bearings
Jerk limited (S curve) motion and soft landing control
Edge grip mechanism design with low clamping forces
Tolerance analysis GD&T DFMEA DOE
Semiconductor standards familiarity: SEMI M1 M49 E57 E84 ISO 14644

Metrology & Testing Skills
Warp bow TTV measurement techniques
Particle measurement and contamination control
Vacuum integrity tests (helium mass spectrometer pressure decay)
Wafer alignment and edge detection sensors (optical/capacitive)
Reliability testing for 24/7 fab duty

Software Skills
CAD: SolidWorks Creo NX
Simulation tools: ANSYS/Abaqus/COMSOL
Data tools: MATLAB Python
Motion/controls: Beckhoff TwinCAT Siemens/Omron PLCs

Soft Skills
Strong cross functional collaboration
Root cause analysis (8D 5 Whys Ishikawa)
Clear documentation & communication
Ownership and design for reliability mindset