Silicon MEMS Fab Process Development Engineer (CoatDevelop)

Description -

What a Fab Process Development Engineer does at HP:

• Develop new photo polymer photo resist coat and ramping up the processes to manufacturing stability.

• Defining and characterize stable and manufacturable coat/develop process steps following the product specification through DOE study to guarantee the best process quality.
• Defining down select and characterize new tooling capability for stable and manufacturable process.
• Lead new technology/process transfer from US to Singapore.
• Engagement with US development team on process development roadmap.
• Lead long term convergence process with UStechnology development team.
• Well versed with latest developments in related technologies/industry.

Individuals who do well in this role at HP usually possess:

• Bachelors or Masters degree in Mechanical Electrical Electronics Chemical or Materials Engineering.
• Possess at least 3 years of experience in semiconductor wafer fab environment.
• Good understanding of semiconductor process Engineering.
• In-depth knowledge of cross technical disciplines analytical skills and problem solving skills with a keen eye to details.
• Advanced project management skills including time and risk management resource prioritization and project structuring.
• Good analytical and problem-solving skills .
• High degree of interpersonal skills and able to work both independently and with cross-functional teams.
• Able to work under tight timeline and fast pace environment.
• Strong communication skills including written presentation negotiation and influencing.
• Able to work in cleanroom.
  

  Disclaimer
  This job description describes the general nature and level of work performed in this role. It is not intended to be an exhaustive list of all duties skills responsibilities knowledge etc. These may be subject to change and additional functions may be assigned as needed by management.
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Equal Opportunity Employer (EEO) -

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