MEMSMicrofluidic Fab Yield Improvement Engineer

Description -

Job Summary:

We are seeking a highly motivated MEMS Wafer Fab Yield Engineer to join our advanced wafer manufacturing team. This role is responsible for driving fab yield analysis and yield improvement through strong data analytics and deep understanding of MEMS fabrication processes. The ideal candidate brings handson knowledge of wafer fab yield strong problemsolving skills and the ability to communicate effectively and collaborate within team and across global crossfunctional teams.

Job Description

What a Fab Yield Improvement Engineer does at HP:

• Perform timely investigation of yield excursions defects and parametric shifts using datadriven statistical analysis of fab data.
• Lead and drive yield improvement projects from problem definition through root cause analysis solution implementation and sustained results.
• Develop and maintain a deep understanding of MEMS wafer fab processes process integration and tool interactions across the manufacturing flow.
• Partner with process integration process equipment product and operations teams to define corrective and preventive actions.
• Collaborate closely with worldwide (WW) fab technology and product teams to align on yield strategies goals share best practices and support cross-site yield improvement initiatives.
• Prepare clear yield reports and technical presentations to communicate findings progress and recommendations to stakeholders.

Key Qualifications

• Bachelor or masters degree in Materials Science Chemical Engineering Mechanical Engineering Physics or a related discipline.
• More than 2 years of experience in MEMS or semiconductor wafer fabrication with exposure to fab processes yield analysis or defect investigation. Handson experience in process integration or yield improvement is an advantage.
• Hands on experience of SPC yield pareto analysis defect density or fab data analysis.

Individuals who do well in this role at HP typically possess:

• Strong understanding of semiconductor or MEMS wafer fab processes.
• Solid analytical and problemsolving skills across multiple technical disciplines with strong attention to detail.
• Good project management skills including timeline risk and resource management.
• Strong interpersonal skills with the ability to work independently and in crossfunctional teams.
• Ability to perform under tight timelines in a fastpaced manufacturing environment.
• Strong communication skills including written presentation and influencing skills.
• High ownership accountability and an agile resultsoriented mindset.
• Strong team player with a collaborative attitude.
• Willingness to travel overseas periodically for shortterm business trip.
• Ability to work in a cleanroom environment.

  
  Disclaimer
  This job description describes the general nature and level of work performed in this role. It is not intended to be an exhaustive list of all duties skills responsibilities knowledge etc. These may be subject to change and additional functions may be assigned as needed by management.
  

  #Li-Post

Job -

Schedule -

Shift -

Travel -

Relocation -

Equal Opportunity Employer (EEO) -

HP Inc. provides equal employment opportunity to all employees and prospective employees without regard to race color religion sex national origin ancestry citizenship sexual orientation age disability or status as a protected veteran marital status familial status physical or mental disability medical condition pregnancy genetic predisposition or carrier status uniformed service status political affiliation or any other characteristic protected by applicable national federal state and local law(s).

Please be assured that you will not be subject to any adverse treatment if you choose to disclose the information requested. This information is provided voluntarily. The information obtained will be kept in strict confidence.

For more information review HPsEEO Policy or read about your rights as an applicant under the law here: Know Your Rights: Workplace Discrimination is Illegal