Process Engineer II Dry Etch

POSITION SUMMARY:

Develop and improve wafer fab processes. Own tools and processes run on them minimizing yield loss and maximizing process performance. Provide production support engineering for a specific product or group of products (inkjet print heads) during and after transfer from design to production. Sustain products with cost reduction and yield improvement efforts. Interface with other engineers to solve technical problems. Work closely with R&D and manufacturing engineering to qualify new tools and processes for volume production.

Knowledge: A seasoned experienced professional with a full understanding of area of specialization; resolves a wide range of issues in creative ways. This job is fully qualified career-oriented journey-level position.

Job Complexity: Works on problems of diverse scope where analysis of data requires evaluation of identifiable factors. Demonstrates good judgment in selecting methods and techniques for obtaining solutions. Networks with senior internal and external personnel in own area of expertise.

Supervision: Normally receives little instruction on day to day works general instructions on new assignments.

Experience: Typically requires a minimum of 5 years of related experience with a Bachelors degree; or 3 years and a Masters degree or PhD without experience; or equivalent work experience.

ESSENTIAL DUTIES AND RESPONSIBILITIES:

Develop and improve wafer fab processes (Silicon Oxide Deep Silicon Ion processes).

Use and run wafer metrology tools to analyze problems failures and other technical issues.

Use good problem solving and project management skills to solve the wide array of technical product problems.

Communicate especially well and motivate others outside and inside the department to resolve problems and accomplish work through various company resources.

Organize technical problem solving strategies clearly and present them effectively to all concerned parties.

Use statistical process control (SPC) design of experiments (DoE) and yield data to help resolve or correct all identified problems.

SUPERVISORY RESPONSIBILITIES:

None

QUALIFICATIONS:

To perform this job successfully an individual must be able to perform each essential duty satisfactorily. The requirements listed below are representative of the knowledge skill and/or ability required. Reasonable accommodations may be made to enable individuals with disabilities to perform the essential functions.

REQUIRED:

Bachelors degree in Engineering Material Science Chemistry or Physics with a minimum of 5 years relevant experience. Experience should include process and design engineering work in a MEMS wafer fab.

Must have related experience in Plasma Etching Ash photo processes...

Ability to find root causes of wafer fab problems.

Excellent problem identification and problem-solving skills.

Ability to apply advanced mathematical concepts such as exponents logarithms quadratic equations and permutations.

Ability to apply mathematical operations to such tasks as frequency distribution determination of test reliability and validity analysis of variance correlation techniques sampling theory and factor analysis.

Ability to respond to common inquiries or complaints from internal resources and customers.

Must have excellent written verbal and presentation skills in order to effectively present information to subordinates customers and management.

PHYSICAL DEMANDS:

The physical demands described here are representative of those that must be met by an employee to successfully perform the essential functions of this job. Reasonable accommodations may be made to enable individuals with disabilities to perform the essential functions.

Standing walking using hands to finger handle or feel and talk or hear under one-third of the time.

Sitting one-third to two-thirds of the time.

WORK ENVIRONMENT:

The work environment characteristics described here are representative of those an employee encounters while performing the essential functions of this job. Reasonable accommodations may be made to enable individuals with disabilities to perform the essential functions.

Works in wafer fabrication and clean room environment.

Exposure to moderate noise levels.

May potentially handle hazardous waste in accordance with the safe work practices defined in Hazardous Communication and Hazardous Waste training programs. Initial training is required upon hiring status and every 3 years thereafter. Employees handling hazardous waste will insure that waste containers in their work areas are properly labeled and dated. Employees will ensure that waste containers are closed after transferring waste to them. Report any incidents involving hazardous waste to supervisor.

OTHER:

Other duties as may be assigned.

Each employees primary objective is to assure that the quality delivery and cost controls within his/her control meet or exceed all of our internal and external customers requirements.

Each employee is required to abide by the Employee Handbook and the rules and regulations explained and provided at each orientation and training session. Special attention must be given to the safety aspects of these documents.