Engineering WSDegree Intern – Process Engineer (Diffusion)

About GlobalFoundries

GlobalFoundries is a leading fullservice semiconductor foundry providing a unique combination of design development and fabrication services to some of the worlds most innovative technology companies. With a global manufacturing footprint spanning three continents GlobalFoundries enables the technologies that transform industries and empower customers to shape their markets.

Role Summary

GlobalFoundries Singapore is seeking highly motivated Engineering WSDegree Interns to support Diffusion Process Engineering within a highvolume stateoftheart semiconductor manufacturing facility. This internship provides progressive exposure to thermal processing dopant activation and process control culminating in a Final Year Project (FYP) aligned to real manufacturing and process challenges.

Key Responsibilities

Block 1: Foundational Learning & Exploration

• Learn semiconductor manufacturing fundamentals and wafer fabrication process flows
• Understand the role of diffusion and thermal processes in device fabrication and performance
• Learn basic concepts of dopant diffusion oxidation annealing and thermal processing
• Understand cleanroom protocols safety requirements and factory operations
• Gain exposure to process control methodologies quality systems and manufacturing standards
• Become familiar with MES fab operations and engineering systems
• Job shadow Diffusion Process Engineers to understand daily engineering activities

Block 2: Process Analysis & Optimization

• Study diffusion process parameters and their impact on electrical performance junction formation and device reliability
• Perform data analysis to monitor process stability variability and trends
• Apply statistical tools (e.g. SPC) to detect excursions and support process improvement
• Support basic process troubleshooting and root cause analysis activities

Block 3 & Final Year Project (FYP): EngineerinTraining Development

• Define FYP scope objectives and deliverables with an assigned industrial mentor
• Execute an FYP focused on diffusion or thermal process characterization optimization or improvement
• Conduct process capability studies and participate in DOE (Design of Experiments)
• Analyze data to support improvements in device performance yield reliability or manufacturability
• Contribute to continuous improvement initiatives related to cost quality or productivity
• Complete the FYP under guidance of an assigned industrial mentor

Skills & Experience Gained

Technical Skills

• Understanding of diffusion and thermal process engineering fundamentals
• Knowledge of wafer fabrication flows dopant behavior and process variability
• Data analysis SPC and structured problemsolving skills

Soft Skills

• Technical communication and presentation skills
• Collaboration within crossfunctional manufacturing and engineering teams
• Exposure to AI and Machine Learning concepts applied to process or manufacturing data

Practical Experience

• Handson experience in a highvolume semiconductor manufacturing environment
• Project ownership within a process engineering function
• Networking opportunities across engineering manufacturing and leadership teams

Required Qualifications

• Enrolled in a Mechanical Electrical Electronics Materials Chemical or related Engineering degree
• Strong analytical datadriven and problemsolving skills
• Curious detailoriented and eager to learn
• Effective time management communication and teamwork skills
• Interest in semiconductor manufacturing and process engineering

Additional Information

• This requisition is exclusively for students enrolled in the WSDegree Programme (2026 intake)
• Internship period must be clearly stated in the CV resume or cover letter