We are seeking a highly specialized engineer to focus on advanced liquid cooling and CDU systems for highdensity data centers and AI computing. This role drives endtoend R&D architecture and productization of chiplevel liquid cooling and Cooling Distribution Unit (CDU) solutions to support both China domestic and global international markets.
What you will do:
1. Lead the design development and optimization of direct liquid cooling systems for highheatflux chips servers and racks including the related heat capture or heat transfer products.
2. Own the full lifecycle development of CDU (Cooling Distribution Unit) systems including architecture component selection fluid control logic and performance validation.
3. Taking advantage of detailed thermal and fluid simulation analysis and optimization tools for liquid cooling system design.
4. Define system requirements performance targets reliability standards and test plans for liquid cooling and CDU products for both China and global markets.
5. Drive reliability and safety design: leak prevention corrosion resistance anticondensation material compatibility and FMEA.
6. Support prototype testing testing validation and mass production transfer for liquid cooling and CDU solutions.
7. Collaborate with global engineering teams customers and suppliers to align with industry standards (ASHRAE OCP ODCC) and market requirements.
8. Support nextgeneration liquid cooling technology roadmap setting up including highefficiency CDU control twophase cooling advanced coolants and lowPUE architectures.
9. Provide technical leadership and support for global projects solution validation and crossregional product alignment.
what we want:
1. Bachelors or above in Thermal Engineering Refrigeration Mechanical Engineering Energy & Power Fluid Mechanics or related field; Master/PhD preferred.
2. 5 years of handson experience in liquid cooling systems CDU development or server/data center thermal management.
3. Deep expertise in:
a) CDU system architecture fluid control pumps heat exchangers and valves
b) Highheatflux thermal management for AI/GPU/CPU/HPC
c) Proficiency in thermal/fluid simulation tools and 3D/CAD tools (Creo/SolidWorks/Inventor Valut).
4. Familiarity with industry standards: ASHRAE OCP GB CE UL for global markets.
5. Experience working on global or crossborder engineering projects is a strong plus.
6. Professional working proficiency in English & Chinese; bilingual communication required.
7. Strong project execution problemsolving and crossfunctional teamwork skills.
What We Offer
Competitive global compensation & benefits
Worldclass R&D platform in liquid cooling and thermal management
Career path for technical expert or engineering management
Opportunities to work on global data center & AI infrastructure projects
Innovationdriven culture and patent development support
Preferred Qualifications
Experience with AI computing highdensity racks or cloud data center customers.
Handson experience with advanced thermal management liquid cooling / CDU systems.
Knowledge of data center PUE energy efficiency standards and reliability design.
Familiarity with IPD agile or stagegate NPD processes.
Competencies
A positive attitude focused on understanding anticipating and responding to the needs of the market and customers both internal and external with Customercentric thinking
Critical thinking skills adequate to understand risk and recommend options accordingly.
Excellent communication skills and strong executive presence with Crossfunctional influence.
Sense of urgency and ownership.
Innovation and market sensitivity
Required Experience:
IC
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