Senior Staff Packaging Engineer
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Job Location:
Bayan Lepas - Malaysia
Monthly Salary:
Not Disclosed
Posted on:
4 hours ago
Vacancies:
1 Vacancy
Job Summary
We are actively advancing technological innovation in the semiconductor package assembly with a focus on next generation packaging technologies such as PowerQFN Flip-Chip and particular the fields of AI High Performance Computing (HPC) and Vertical Power Delivery (VPD) are rapidly increasing their demand for higher density higher reliability and high thermal dissipation package technologies.
This role offers the opportunity to work on cutting edge technologies such as power packages for AI/HPC VPD Server VR core/peripheral and Accelerator/GPU markets and contribute to the development of packaging technologies that underpin innovations shaping society including AI and next generation mobile computing.
Key Responsibilities:
- Design and develop package and interconnect methods for Renesass packaging needs in the areas of Power SiP/modules flip-chip LGA multi-chip module and power device packaging
- Work with OSAT/CM to develop run DOEs to optimize processes and establish process specifications.
- Work with Product Groups and Reliability teams to qualify new packages and processes within required time frame.
- Ensure smooth transition into production by resolving all process integration issues establishing production controls and monitors and monitoring / resolving process issues.
- Develop and maintain technical expertise on advances and innovations in advanced leadframe power SiP/modules and flip chip interconnects.
- Address internal and external customer complaints working with peers of Marketing Product groups Quality and Operations organization to satisfy growth in businesses.
Qualifications :
- Masters / Bachelors degree in Physics Chemistry Mechanical Electrical or Materials Engineering.
- 5-15 years of relevant experience in package development emphasizing leadframe laminate power SiP/module and flip-chip packaging.
- Understanding of semiconductor power device package assembly processes materials and technology. Knowledge of AutoCAD Excel PowerPoint Word. Knowledge of wire-bonding flip chip multi-chip module SPC (Statistical Process Control) and statistical analysis.
- Strong interpersonal and communication skills.
- Strong analytical and presentation skills.
Additional Information :
Renesas is an embedded semiconductor solution provider driven by its Purpose To Make Our Lives Easier. As the industrys leading expert in embedded processing with unmatched quality and system-level know-how we have evolved to provide scalable and comprehensive semiconductor solutions for automotive industrial infrastructure and IoT industries based on the broadest product portfolio including High Performance Computing Embedded Processing Analog & Connectivity and Power.
With a diverse team of over 21000 professionals in more than 30 countries we continue to expand our boundaries to offer enhanced user experiences through digitalization and usher into a new era of innovation. We design and develop sustainable power-efficient solutions today that help people and communities thrive tomorrow To Make Our Lives Easier.
At Renesas you can:
- Launch and advance your career in technical and business roles across four Product Groups and various corporate functions. You will have the opportunities to explore our hardware and software capabilities and try new things.
- Make a real impact by developing innovative products and solutions to meet our global customers evolving needs and help make peoples lives easier safe and secure.
- Maximize your performance and wellbeing in our flexible and inclusive work environment. Our people-first culture and global support system including the remote work option and Employee Resource Groups will help you excel from the first day.
Are you ready to own your success and make your mark
Join Renesas. Lets Shape the Future together.
Renesas Electronics is an equal opportunity and affirmative action employer committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex race religion national origin gender gender identity gender expression age sexual orientation military status veteran status or any other basis protected by law. For more information please read our Diversity & Inclusion Statement.
We have adopted a hybrid model that gives employees the ability to work remotely two days a week while ensuring that we come together as a team in the office the rest of the time. The designated in-office days are Tuesday through Thursday for innovation collaboration and continuous learning.
Remote Work :
No
Employment Type :
Full-time
Key Skills
- Continuous Integration
- Food Industry
- Minitab
- Packaging
- CAD
- Mechanical Knowledge
- Plastics Blow Molding
- SolidWorks
- Mechanical Engineering
- Plastics Injection Molding
- Microsoft Project
- Manufacturing
About Company
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