Senior Flip Chip Manufacturing Process Engineer

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Texas Instruments is looking for an energetic engineer with a passion for process. This position provides the opportunity to drive continual improvement at all levels. Our team is primarily focused on driving improved procedures and processes. We are searching for a self-directed highly motivated engineer to join our team.

The responsibilities of a Manufacturing Process Engineer in this role include:

• Support manufacturing operations
• Develop and implement improved methods of manufacturing procedures and processes that result in improved efficiencies yields machine operations and quality.
• Develop new automated die attach programs optimize process parameters and recipe standardization.
• Support die attach processes for customer deliverable materials. (i.e. specialization for flip chip packages)
• Document die attach process details in specification(s) and work instructions
• Define applicable die attach materials for specific applications (flux solder paste bumps etc.)
• Define statistical monitoring methods and automated monitoring methods supporting developed die attach processes
• Support reflow and flux wash processes for flip chip devices (i.e. recipe generation and production monitoring activities)
• Implement project or improvement plans for areas of responsibility including but not limited to: efficiency improvements cost reduction or quality improvement programs new product support process simplification and process system/data analysis automation.
• Identify systematic problems in either process or equipment related sources communicating findings to the engineering staff in a continuous manner leading the team to find systemic actions and monitoring throughput.
• Support the manufacturing ramp with execution of equipment/process startup process experiments (SWRs)
• Supervise and lead a team of process technicians.

Minimum requirements:

• Bachelors degree in Chemical Engineering Chemistry Electrical Engineering Materials Science Engineering Mechanical Engineering Physics or a related field
• Minimum 5 years of relevant experiences in flip chip process
• Strong foundation in statistical process control engineering change control and process release strategies.
• Strong foundation for data analytic applications and analysis.

Preferred qualifications:

• Goal oriented self-starter with a sense of urgency.
• Strong verbal and written communication skills ability to present projects and updates with confidence.
• Ability to work in teams and collaborate effectively with people in different functions.
• Strong time management skills and priority management that enable on-time project delivery
• Demonstrated ability to build strong influential relationships not only with direct network within the area but also several support groups that enable the manufacturing line.
• Ability to work effectively in a fast-paced and rapidly changing environment
• Ability to take the initiative and drive for results with quality in mind.
• Have basic knowledge in set-up and parameter optimization for ASM Die Bonder machines (ASM 8312 ITEC ADAT)
• Have basic knowledge in set-up and recipe optimization for reflow and fluxwash process.
• Have knowledge in using statistical analysis tools (Excel Minitab Spotfire JMP) will be an added advantage.
• Have knowledge in Quality Tools (FTA Fish Bone etc.) and Problem-Solving documents (8D report RCA DMAIC) will be an added advantage.
• Prior experience in handling flip chip die attach reflow and flux wash process will be an added advantage.