Senior Process Engineer (Plating)

Nexperia

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profile Job Location:

Seremban - Malaysia

profile Monthly Salary: Not Disclosed
Posted on: 2 days ago
Vacancies: 1 Vacancy

Job Summary

About the Role

We are seeking a highly driven and technically strong Plating Process Engineer to lead sustaining and continuous enhancement initiatives across semiconductor packaging operations. This role plays a critical part in ensuring plating process stability yield improvement and high equipment performance to support advanced and high-volume manufacturing (HVM).

You will work closely with cross-functional teams including Equipment Engineering R&D NPI Product Design and Reliability to ensure plating capabilities meet evolving package architecture and technology requirements.

What You Will Do

  • Lead and manage sustaining activities and continuous improvement of plating processes across multiple semiconductor package platforms.

  • Conduct routine process capability and performance evaluations to ensure alignment with manufacturing standards.

  • Identify sources of process variation and yield loss; drive corrective and preventive actions to improve in-line practices lot-on-hold (LOH) management and overall process capability.

  • Execute LOH dispositions and collaborate with treatment teams to accelerate lot movement and minimize production delays.

  • Partner with Equipment Engineering to validate new product designs during development and qualification for HVM readiness.

  • Maintain and update technical documentation including control plans process specifications SOPs FMEAs and technical reports.

  • Strategically plan technician coverage to support 24/7 manufacturing operations; delegate tasks effectively and ensure operational transparency.

  • Mentor and develop technicians by strengthening engineering mindset setting KPIs and conducting annual performance evaluations.

  • Apply structured engineering analysis and statistical tools to troubleshoot plating-related defects and implement robust solutions.

  • Support seamless technology transfers including new chemicals processes and equipment into production environments.

  • Contribute to advanced packaging technology roadmaps including thin form factors and emerging device architectures.

  • Drive continuous improvement initiatives such as MVA yield enhancement and UPH optimization.

  • Coordinate with suppliers and vendors for jig and fixture procurement ensuring timely delivery of spare and non-spare parts.

  • Thrive in a fast-paced high-mix high-volume manufacturing environment.

What You Will Need

  • Bachelors Degree in Engineering (Chemical Engineering preferred).

  • Minimum 5 years of experience in the semiconductor industry with at least 3 years focused on plating processes.

  • Strong hands-on experience with semiconductor packaging plating equipment.

  • Proficiency in statistical analysis tools such as JMP and Minitab.

  • Strong technical documentation and reporting skills.

  • Solid understanding of chemical interactions with metal alloys epoxy compounds and related materials (advantageous).

  • Demonstrated ability to troubleshoot complex process issues using data-driven methodologies.

  • Strong leadership cross-functional collaboration and communication skills.

  • Commitment to strict compliance with Environmental Health & Safety (EHS) standards and chemical handling protocols.

Talent acquisition based on Nexperia vacancies is not appreciated. Nexperia job adverts are Nexperia copyright material and the word Nexperia is a registered trademark.

D&I Statement

As an equal-opportunity employer Nexperia values diversity not just because it is the right thing to do but because diverse teams perform better. We are dedicated to being inclusive and a proof point of this dedication is that we were the main partner of the very first Dutch Paralympic Team NL House during the Paris 2024 Paralympic Games. Our recruitment process is inclusive and accessible to all and we consider all applicants fairly as well as providing a safe work environment and reasonable adjustments where requested.

In addition we offer our colleagues the possibility to join employee resource groups such as the Pride Network Group or global and local Womens groups. Nexperia is committed to increasing women in management positions to 30% by 2030.


Required Experience:

Senior IC

About the RoleWe are seeking a highly driven and technically strong Plating Process Engineer to lead sustaining and continuous enhancement initiatives across semiconductor packaging operations. This role plays a critical part in ensuring plating process stability yield improvement and high equipment...
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Key Skills

  • Distributed Control Systems
  • Continuous Improvement
  • Process Improvement
  • Minitab
  • Root cause Analysis
  • Tooling
  • Statistical Software
  • Process Engineering
  • cGMP
  • Programmable Logic Controllers
  • Public Speaking
  • Manufacturing

About Company

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Headquartered in the Netherlands, Nexperia is a global semiconductor company with a rich European history and over 15,000 employees across Europe, Asia, and the United States.

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