Senior Engineer I Packaging

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Job Description:

This position for an Intermediate Package Development Engineer who will oversee and manage all aspects of IC package development from initial design and performance considerations to package design optimization determining design rules for manufacturing selecting and interfacing with suitable technology and manufacturing partners and completing package qualification cooperate with internal business unit designers operations teams and reliability resources and final release products to production.

The primary business unit requires packaging in flip chip BGA packaging using Cu Pillar Bump high-density build-up substrates multi-chip modules system-in-package and other leading-edge advanced packaging solutions.

Responsibilities include the following:

Work with the designated business units and co-design package solutions that meet the performance thermal and reliability requirements for the designated application space.

Identify suitable IC package options and perform feasibility studies for all NPI (new product introduction) provide direct interface with multiple third-party assembly sites as well as internal design groups product engineering and product marketing and act as the available expert resource for packaging-related aspects of the product.

Ensure early success in package development with substantial modeling and simulation for thermal mechanical and electrical addition act as the thermal and mechanical expert resource for product validation and application teams and end customers for support on system-level solutions.

Oversee evaluation and development of new packaging materials and processes

Manage qualifications of new packages or package changes to ensure quality and mitigate risk

Author corporate and supplier-level presentations outlining package roadmaps and package technologies

Author and maintain design rules documents and application notes on package-specific topics

Draft preliminary package outline drawings for internal product development teams

Initiate and follow up on assembly build instructions for all engineering builds

Assist with global cost reduction standardization and new system implementation projects

Requirements/Qualifications:

BSME BSEE or BS in Chemical Engineering plus 5 years of experience

Experience with advanced laminate (BGA) and QFN package design and assembly

Well-developed knowledge of thermal & electrical simulations ideally Siemens Flotherm or Ansys Workbench and related tools

Experience with thermal design considerations including heat sink design and selection

Superior communication and presentation skills and the ability to lead a small team as needed including mentoring junior engineers

Ability to problem-solve and assist the reliability group on FAs on assembly related failures

Knowledge of JEDEC qualification methods for advanced BGA and high-power ICs

Ability to carry out multiple projects simultaneously set timelines and prioritize projects

Ability to author and comprehend engineering drawings

Familiarity with ANSI Y-14 drafting nomenclature

Travel to Asia occasionally to attend technology reviews and resolve subcon issues

Competence in working with multiple databases technical acronyms and complex data sets

Beneficial Skills

Package Design using Cadence APD

High frequency/SI analysis knowledge

Travel Time:

Physical Attributes:

Physical Requirements:

Pay Range:

Benefits of working at Microchip

Microchip Technology Inc is an equal opportunity/affirmative action employer. All qualified applicants will receive consideration for employment without regard to sex gender identity sexual orientation race color religion national origin disability protected Veteran status age or any other characteristic protected by law.

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