We are seeking a development engineer for MEMS assembly and interconnect technologies who likes to cooperate closely with our partners. You will work with industry-leading OSATs machine and material suppliers to develop packaging processes that enable the realization of a large variety of MEMS devices.
- Working on-site at one of the largest assembly partners closely cooperating with the local teams of our supplier.
- Part of a team of packaging experts within Bosch and our suppliers to develop and characterize new and innovative optical MEMS device packages.
- Part of an interdisciplinary product development team with customer representatives purchasing MEMS design and technology reliability testing simulation construction production and quality team members.
- Responsible for the material and machine selection and associated process development for core assembly steps.
- Selecting and qualifying new suppliers (assembly subcons equipment and raw material suppliers).
- Co-working with equipment suppliers to enhance existing or to develop new machines.
- Take care of the development qualification and transfer to mass production of new assembly processes and materials.
- Owner of specifications and technical documentation concerning the optical MEMS package assembly process and raw materials.
Qualifications :
- Education: Master or Bachelor degree in material or natural science (physics chemistry) or mechanical / electrical engineering or material science.
- Experience and Skills: Minimum of 3 years preferred 7 years of experience in sensor and/or package development.
- Knowledge and skills in EOL assemble handling BGA QFN LGA MEMS packages FOL EOL assembly FMEA SPC and 8D.
- Personality: team player problem solver broad technical interests creativity initiative autonomy flexibility leadership agility with ability to work with minimum supervision.
- Languages: Very good English skills in speaking and writing.
- Intercultural Skills: Willingness to travel.
Additional Information :
Your future job offers you.
Flexible work time medical services and benefits & services.
Remote Work :
No
Employment Type :
Full-time
We are seeking a development engineer for MEMS assembly and interconnect technologies who likes to cooperate closely with our partners. You will work with industry-leading OSATs machine and material suppliers to develop packaging processes that enable the realization of a large variety of MEMS devic...
We are seeking a development engineer for MEMS assembly and interconnect technologies who likes to cooperate closely with our partners. You will work with industry-leading OSATs machine and material suppliers to develop packaging processes that enable the realization of a large variety of MEMS devices.
- Working on-site at one of the largest assembly partners closely cooperating with the local teams of our supplier.
- Part of a team of packaging experts within Bosch and our suppliers to develop and characterize new and innovative optical MEMS device packages.
- Part of an interdisciplinary product development team with customer representatives purchasing MEMS design and technology reliability testing simulation construction production and quality team members.
- Responsible for the material and machine selection and associated process development for core assembly steps.
- Selecting and qualifying new suppliers (assembly subcons equipment and raw material suppliers).
- Co-working with equipment suppliers to enhance existing or to develop new machines.
- Take care of the development qualification and transfer to mass production of new assembly processes and materials.
- Owner of specifications and technical documentation concerning the optical MEMS package assembly process and raw materials.
Qualifications :
- Education: Master or Bachelor degree in material or natural science (physics chemistry) or mechanical / electrical engineering or material science.
- Experience and Skills: Minimum of 3 years preferred 7 years of experience in sensor and/or package development.
- Knowledge and skills in EOL assemble handling BGA QFN LGA MEMS packages FOL EOL assembly FMEA SPC and 8D.
- Personality: team player problem solver broad technical interests creativity initiative autonomy flexibility leadership agility with ability to work with minimum supervision.
- Languages: Very good English skills in speaking and writing.
- Intercultural Skills: Willingness to travel.
Additional Information :
Your future job offers you.
Flexible work time medical services and benefits & services.
Remote Work :
No
Employment Type :
Full-time
View more
View less