Advanced Packaging Engineer SIPI
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Job Location:
Monthly Salary:
Posted on:
30+ days ago
Vacancies:
1 Vacancy
Job Summary
About Marvell
Marvells semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise cloud and AI and carrier architectures our innovative technology is enabling new possibilities.
At Marvell you can affect the arc of individual lives lift the trajectory of entire industries and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation above and beyond fleeting trends Marvell is a place to thrive learn and lead.
This is an existing vacancy.
Your Team Your Impact
Join Marvells central packaging organization responsible for enabling nextgeneration connectivity and compute products. Youll contribute to the design modeling and validation of advanced IC packages supporting highspeed interfaces. Your work in SI/PI will directly influence product performance reliability and timetomarket.What You Can Expect
- Collaborate with IC design physical layout assembly engineering and marketing to support package planning and substrate design.
- Build and correlate SI/PI models for advanced interconnects; perform 2D/3D EM simulations and generate routing stackup and decoupling guidelines.
- Analyze powerdistribution networks and highspeed signal paths from prelayout through postlayout.
- Perform VNA and TDR characterization of package/PCB structures and compare bench data with simulations.
- Automate analysis workflows using Python (e.g. simulation sweeps reporting rule checks).
- Document technical results and present recommendations to crossfunctional teams.
- Contribute to design reviews and support the release of package designs to manufacturing.
- Use tools such as HFSS SIWave/Clarity PowerSI Spectre/ADS/HSpice and APD or PADS.
What Were Looking For
- MS or PhD in Electrical/Electronics Engineering Materials Science or related fields.
- Strong fundamentals in electromagnetics transmission lines and microwave theory.
- Experience with 2D/3D EM simulation tools (HFSS SIWave Clarity).
- Familiarity with IC package layout tools such as APD or PADS.
- Understanding of highspeed signaling in both frequency and time domain.
- Exposure to VNA/TDR characterization methods.
- Working knowledge of circuitsimulation tools (Spectre ADS HSpice).
- Python scripting experience for SI/PI or packaging automation.
- Familiarity with packaging technologies materials substrate design rules and assembly processes.
- Awareness of EMI/EMC debugging and simulation practices.
- Bonus: Experience with 2.5D/3D package development MATLABbased channel simulations or basic thermal/mechanical analysis.
- Strong communication presentation and documentation skills.
- A collaborative team player eager to learn and grow.
Expected Base Pay Range (CAD)
86300 - 115000 $ per annumAdditional Compensation and Benefit Elements
With competitive compensation and great benefits you will enjoy our workstyle within an environment of shared collaboration transparency and inclusivity. Were dedicated to giving our people the tools and resources they need to succeed in doing work that matters and to grow and develop with us. For additional information on what its like to work at Marvell visit our Careers page.
All qualified applicants will receive consideration for employment without regard to race color religion sex national origin sexual orientation gender identity disability or protected veteran status.
Interview Integrity
To support fair and authentic hiring practices candidates are not permitted to use AI tools (such as transcription apps real-time answer generators like ChatGPT or Copilot or automated note-taking bots) during interviews.
These tools must not be used to record assist with or enhance responses in any way. Our interviews are designed to evaluate your individual experience thought process and communication skills in real time. Use of AI tools without prior instruction from the interviewer will result in disqualification from the hiring process.
This position may require access to technology and/or software subject to U.S. export control laws and regulations including the Export Administration Regulations (EAR). As such applicants must be eligible to access export-controlled information as defined under applicable law. Marvell may be required to obtain export licensing approval from the U.S. Department of Commerce and/or the U.S. Department of State. Except for U.S. citizens lawful permanent residents or protected individuals as defined by 8 U.S.C. 1324b(a)(3) all applicants may be subject to an export license review process prior to employment.
Marvell may employ artificial intelligence technologies to assist in the evaluation of job applications. All application reviews include meaningful human involvement and no hiring decisions are made solely on the basis of automated processing.
#LI-SC1Required Experience:
IC
Key Skills
- Continuous Integration
- Food Industry
- Minitab
- Packaging
- CAD
- Mechanical Knowledge
- Plastics Blow Molding
- SolidWorks
- Mechanical Engineering
- Plastics Injection Molding
- Microsoft Project
- Manufacturing
About Company
Designed for your current needs and future ambitions, Marvell delivers the data infrastructure technology transforming tomorrow’s enterprise, cloud, automotive, and carrier architectures for the better.
