Senior Photonics Packaging Engineer
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Job Location:
Monthly Salary:
Posted on:
4 days ago
Vacancies:
1 Vacancy
Job Summary
JOB SUMMARY
Develops and implements production/processing methods and controls to meet quality standards in the most efficient manner for Photonic and Electronic Advanced Packaging.
Monitors the assembly process; troubleshooting problem processes and assisting in resolving quality issues. Is the technical expert on various projects/productions jobs and process as required.
ESSENTIAL DUTIES AND RESPONSIBILITIES
Develop new assembly processes including material selection methods and continuous improvement.
Operate production and test equipment in a prototype/NPI line.
Work with colleague engineers technicians and operators for NPI and prototype production.
Act as equipment prime for specific machines driving procurement maintenance spares and service as required.
May lead the startup of new/existing projects/production jobs optimizing cost efficiency and quality.
May lead the process control and maintain appropriate documentation.
Monitor the assembly/molding process running in production; troubleshoot problems associated with processes and assist in resolving quality issues.
Establish detailed processes for new product lines; document product development and changes; evaluate new product performance; and monitor new tool design.
Debug significant complex problems in new systems tooling and automation.
Design major experiments to enhance processes as well as improve yields and utilization through reduced cycle and efficient set-up.
Lead and implement major maintenance changes in process improvements; propose or specify repair alteration of automation while ensuring adequate documentation is maintained.
Provide functional and technical mentoring to process technicians and other process engineers.
Maintain a clean and safe work environment; supporting all company safety programs and initiatives.
Support all company safety and quality programs and initiatives.
Apply and support Lean Manufacturing principles.
May perform other duties and responsibilities as assigned.
JOB QUALIFICATIONS
KNOWLEDGE REQUIREMENTS
At least five years of compatible experience with advanced packaging particularly flip-chip die bond wire bond and alignment.
Master level or above degree in related discipline.
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Jabil including its subsidiaries is an equal opportunity employer and considers qualified applicants for employment without regard to race color religion national origin sex sexual orientation gender identity age disability genetic information veteran status or any other characteristic protected by law.
Accessibility Accommodation
If you are a qualified individual with a disability you have the right to request a reasonable accommodation if you are unable or limited in your ability to use or access site as a result of your disability. You can request a reasonable accommodation by sending an e-mail to with the nature of your request and contact information. Please do not direct any other general employment related questions to this e-mail. Please note that only those inquiries concerning a request for reasonable accommodation will be responded to.#whereyoubelong
Required Experience:
Senior IC
Key Skills
- Continuous Integration
- Food Industry
- Minitab
- Packaging
- CAD
- Mechanical Knowledge
- Plastics Blow Molding
- SolidWorks
- Mechanical Engineering
- Plastics Injection Molding
- Microsoft Project
- Manufacturing
About Company
At Jabil we strive to be the most technologically advanced and trusted manufacturing solutions provider.
