Member of Technical Staff, NAND Advanced Thin Films Process Development

The Member of Technical Staff (MTS) in Process Development forAdvanced ThinFilm plays a critical role in advancing thin film process development for NAND memory technology. This positionis responsible forperforming experiments conducting material characterization and providing support for process integration and fixing. As a key contributor the MTS collaborates with senior engineers andMulti-functionalteams to promote manufacturability continuous improvement and ongoing technology advancement within the organization.

Key Responsibilities

• Lead project-level initiatives focused on the development ofstructural and electricalfilm processes especially dielectric (including Low and High K) andCarbon basedfilms.

• Carry out complex experiments and support process integration under the guidance of senior staff members.

• Use technicalexpertiseto achieve measurable results thatbenefitthe department or site.

• Collaborate with various functions tofacilitatetechnology transfer andassistinprocessramp-up activities.

• Maintainaccurateand thorough records of experiments andprocesses andprepare comprehensive technical reports.

• Mentor staff members early in their careers and provide leadership that aligns with TLP entry expectations.

• Support initiatives aimed at continuous improvement and optimization of existing processes.

• Participate in multi-functional problem-solving teams to address process challenges and drive innovation.

• Contribute to the development and documentation of guidelines standard operating procedures and knowledge management systems.

• Know the latest with emerging technologies industry trends and advancements in thin film processing and characterization.

Technical Qualifications

• Demonstratedexpertisein thin film deposition techniques such as Atomic Layer Deposition (ALD) and Chemical Vapor Deposition (plasma and thermal) including recipe setup process tuning and fixing.

• Proficiencyin using metrology toolsincluding ellipsometry X-ray reflectivity (XRR) Scanning Electron Microscopy (SEM) and Transmission Electron Microscopy (TEM)for material characterization and process monitoring.

• Solid understanding of process integration defect analysis and methods for yield improvement.

• Familiarity with electrical evaluation methods and Fab metrology tools such as CD-SEM thickness measurement instruments and particle counters.

• Competence in process optimization documentation and data analysis including statistical process control (SPC) design of experiments (DOE) and root cause analysis.

• Experience withfixing process issues implementing corrective actions and supporting technology transfer from R&D to manufacturing.

• Ability to communicate technical findings effectively both verbally and in writing to diverse audiences.

• Experience with knowledge management systems SOP development and compliance with safety and quality standards.

• PhD or equivalent degree in Materials Science Chemical Engineering Physics Chemistry Electrical Engineering or a closely related field.

• 10 to 15 years of experience in Thin Film research and development for NANDprocessspecifically DiffusionandCVD Films.

• Demonstrated experience in multi-functional collaboration and project-level leadership.

• Strong record of technical contributions publications or patents in relevant domains (preferred).