The PCB Substrate DFM Engineer will have a deep level of creativity and curiosity about materials science and electronic packaging at all levels. The responsibilities of this role include:- Maintenance of printed circuit board and substrate design rules for all Apple products as well as the technology roadmap and acceptability specifications- Establishment and maintenance of supplier site material and technology qualification matrix- Action as the directly responsible individual on all substrate and printed circuit board related quality issues and excursionsIn the course of fulfilling these responsibilities the person in this role will:- Provide mentorship to product designers on available substrate and printed circuit board technologies and materials- You will interact with and guide PCB and substrate layout designers to select layer structures design rule sets and practices- Work with design tool engineers to define and validate appropriate scripting design rule checks etc- You will support design for cost investigations as the liaison between engineering and procurement- Audit and assess PCB and substrate vendor production lines including manufacturing techniques and quality control systems- Review new technology qualification data and make disposition decisions- Review new product introduction first article data and make disposition decisions- You will drive corrective actions for PCB and substrate vendor issues using step-by-step methodology
- 3 years experience with printed circuits including hands-on process engineering experience
- Demonstrated capability of qualifying new materials chemistries equipment sets and/or processes to high volume production
- BS or higher in materials science chemical mechanical or electrical engineering
- Strong knowledge of industry specifications especially IPC and JEDEC specifications
- Understand the interaction between manufacturing processes and environments with printed circuit defect conditions especially latent defects
- Understand statistical process and quality control principles and be capable to apply statistical analysis methods to raw data sets
- Understand the relationships between design rules process capability yield and product reliability and how to improve them
The PCB Substrate DFM Engineer will have a deep level of creativity and curiosity about materials science and electronic packaging at all levels. The responsibilities of this role include:- Maintenance of printed circuit board and substrate design rules for all Apple products as well as the technol...
The PCB Substrate DFM Engineer will have a deep level of creativity and curiosity about materials science and electronic packaging at all levels. The responsibilities of this role include:- Maintenance of printed circuit board and substrate design rules for all Apple products as well as the technology roadmap and acceptability specifications- Establishment and maintenance of supplier site material and technology qualification matrix- Action as the directly responsible individual on all substrate and printed circuit board related quality issues and excursionsIn the course of fulfilling these responsibilities the person in this role will:- Provide mentorship to product designers on available substrate and printed circuit board technologies and materials- You will interact with and guide PCB and substrate layout designers to select layer structures design rule sets and practices- Work with design tool engineers to define and validate appropriate scripting design rule checks etc- You will support design for cost investigations as the liaison between engineering and procurement- Audit and assess PCB and substrate vendor production lines including manufacturing techniques and quality control systems- Review new technology qualification data and make disposition decisions- Review new product introduction first article data and make disposition decisions- You will drive corrective actions for PCB and substrate vendor issues using step-by-step methodology
- 3 years experience with printed circuits including hands-on process engineering experience
- Demonstrated capability of qualifying new materials chemistries equipment sets and/or processes to high volume production
- BS or higher in materials science chemical mechanical or electrical engineering
- Strong knowledge of industry specifications especially IPC and JEDEC specifications
- Understand the interaction between manufacturing processes and environments with printed circuit defect conditions especially latent defects
- Understand statistical process and quality control principles and be capable to apply statistical analysis methods to raw data sets
- Understand the relationships between design rules process capability yield and product reliability and how to improve them
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